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1 - 36 of about 36 for 208B |
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First line: Filename 208b.doc Version TELEFILTER Measurement condition Ambient temperature Input power level Terminating Abstract: .. Filename: tfs 208b.doc Version 1.5 05.08.2005. VI TELEFILTER Filter specification TFS 208B 1/5. Tele Filter GmbH. Potsdamer Straße 18. D 14 513 TELTOW / Germany. Tel: +49 3328 4784-0 / Fax: +49 3328 .. datasheet abstract.. |
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First line: tfs208B.doc Version TELEFILTER Measurement condition Ambient temperature Input power level Terminating impedances Abstract: .. tfs208B.doc Version 1.2 30.11.00. VI TELEFILTER Filter Specification TFS 208B Page 1 / 5. VI TELEFILTER Vectron International, Inc.. Potsdamer Straße 18 267 Lowell Road. D 14 513 TELTOW / Germany .. datasheet abstract.. |
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First line: HRW2502A S Silicon Schottky Barrier Diode Rectifying ADE-208-208B Rev. Jan. Features forward voltage Abstract: .. HRW2502A S Silicon Schottky Barrier Diode for Rectifying. ADE-208-208B Z Rev. 2 Jan. 1996. Features. • Low forward voltage drop and suitable for high effifiency rectifying. • Same power as TO .. datasheet abstract.. |
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First line: ADE-208-208B Z HRW2502A Silicon Schottky Barrier Diode Rectifying Rev. Jan. Features forward voltage Abstract: .. ADE-208-208B Z Rev. 2. Jan. 1996. HRW2502A S. Silicon Schottky Barrier Diode for Rectifying .. datasheet abstract.. |
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First line: ASSY 2-15 SERIES Assy. Proc Housing Options Terminal Term Matl Plating Voids Abstract: .. Terminal No: 2144-BA-A1AA-102B Terminal No: 2144-BA-A1AA-208B Terminal No: 6298-1-102 Terminal No: 6298-1-208. Term Matl: PHOS BRONZE Term Matl: PHOS BRONZE Term Matl: PHOS BRONZE Term Matl .. datasheet abstract.. |
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First line: Issue A00NAD3470 Date issue 15-Oct-02 Classification Change Renewal PRODUCT SPECIFICATION INFORMATION Product Abstract: .. 208B相当] More than 95% must be. [Equal to covered with solder. MIL-STD-202D-208B] uniformly. 半田 Solder 63Sn共晶半田,ロジン樹脂 25wt%,ロジンイソプロピルアル フラックス Flux コ-ル75wt% 63%Sn Eutectic Solder with Rosin .. datasheet abstract.. |
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First line: Issue A00NAD3371 Date issue 15-Oct-02 Classification Change Renewal PRODUCT SPECIFICATION INFORMATION Product Abstract: .. 208B相当] More than 95% must be. [Equal to covered with solder. MIL-STD-202D-208B] uniformly. 半田 Solder 63Sn共晶半田,ロジン樹脂 25wt%,ロジンイソプロピルアル フラックス Flux コ-ル75wt% 63%Sn Eutectic Solder with Rosin .. datasheet abstract.. |
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First line: Issue A00NAD3364 Date issue 15-Oct-02 Classification Change Renewal PRODUCT SPECIFICATION INFORMATION Product Abstract: .. 208B相当] More than 95% must be. [Equal to covered with solder. MIL-STD-202D-208B] uniformly. 半田 Solder 63Sn共晶半田,ロジン樹脂 25wt%,ロジンイソプロピルアル フラックス Flux コ-ル75wt% 63%Sn Eutectic Solder with Rosin .. datasheet abstract.. |
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First line: Issue A00NAD3362A Date issue 15-Oct-02 Classification Change Renewal PRODUCT SPECIFICATION INFORMATION Product Abstract: .. 208B相当] More than 95% must be. [Equal to covered with solder. MIL-STD-202D-208B] uniformly. 半田 Solder 63Sn共晶半田,ロジン樹脂 25wt%,ロジンイソプロピルアル フラックス Flux コ-ル75wt% 63%Sn Eutectic Solder with Rosin .. datasheet abstract.. |
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First line: Issue A00NAD3326 Date issue 15-Oct-02 Classification Change Renewal PRODUCT SPECIFICATION INFORMATION Product Abstract: .. 208B相当] More than 95% must be. [Equal to covered with solder. MIL-STD-202D-208B] uniformly. 半田 Solder 63Sn共晶半田,ロジン樹脂 25wt%,ロジンイソプロピルアル フラックス Flux コ-ル75wt% 63%Sn Eutectic Solder with Rosin .. datasheet abstract.. |
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First line: Issue A00NAD3306 Date issue 15-Oct-02 Classification Change Renewal PRODUCT SPECIFICATION INFORMATION Product Abstract: .. 208B相当] More than 95% must be. [Equal to covered with solder. MIL-STD-202D-208B] uniformly. 半田 Solder 63Sn共晶半田,ロジン樹脂 25wt%,ロジンイソプロピルアル フラックス Flux コ-ル75wt% 63%Sn Eutectic Solder with Rosin .. datasheet abstract.. |
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First line: Issue A00NAD3471 Date issue 15-Oct-02 Classification Change Renewal PRODUCT SPECIFICATION INFORMATION Product Abstract: .. 208B相当] More than 95% must be. [Equal to covered with solder. MIL-STD-202D-208B] uniformly. 半田 Solder 63Sn共晶半田,ロジン樹脂 25wt%,ロジンイソプロピルアル フラックス Flux コ-ル75wt% 63%Sn Eutectic Solder with Rosin .. datasheet abstract.. |
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First line: Issue A00NAD3363 Date issue 15-Oct-02 Classification Change Renewal PRODUCT SPECIFICATION INFORMATION Product Abstract: .. 208B相当] More than 95% must be. [Equal to covered with solder. MIL-STD-202D-208B] uniformly. 半田 Solder 63Sn共晶半田,ロジン樹脂 25wt%,ロジンイソプロピルアル フラックス Flux コ-ル75wt% 63%Sn Eutectic Solder with Rosin .. datasheet abstract.. |
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First line: Issue A00NAD3360 Date issue 15-Oct-02 Classification Change Renewal PRODUCT SPECIFICATION INFORMATION Product Abstract: .. 208B相当] More than 95% must be. [Equal to covered with solder. MIL-STD-202D-208B] uniformly. 半田 Solder 63Sn共晶半田,ロジン樹脂 25wt%,ロジンイソプロピルアル フラックス Flux コ-ル75wt% 63%Sn Eutectic Solder with Rosin .. datasheet abstract.. |
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First line: Issue A00NAD3353 Date issue 15-Oct-02 Classification Change Renewal PRODUCT SPECIFICATION INFORMATION Product Abstract: .. 208B相当] More than 95% must be. [Equal to covered with solder. MIL-STD-202D-208B] uniformly. 半田 Solder 63Sn共晶半田,ロジン樹脂 25wt%,ロジンイソプロピルアル フラックス Flux コ-ル75wt% 63%Sn Eutectic Solder with Rosin .. datasheet abstract.. |
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First line: Issue A00NAD3324 Date issue 15-Oct-02 Classification Change Renewal PRODUCT SPECIFICATION INFORMATION Product Abstract: .. 208B相当] More than 95% must be. [Equal to covered with solder. MIL-STD-202D-208B] uniformly. 半田 Solder 63Sn共晶半田,ロジン樹脂 25wt%,ロジンイソプロピルアル フラックス Flux コ-ル75wt% 63%Sn Eutectic Solder with Rosin .. datasheet abstract.. |
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First line: Issue A00NAD3323 Date issue 15-Oct-02 Classification Change Renewal PRODUCT SPECIFICATION INFORMATION Product Abstract: .. 208B相当] More than 95% must be. [Equal to covered with solder. MIL-STD-202D-208B] uniformly. 半田 Solder 63Sn共晶半田,ロジン樹脂 25wt%,ロジンイソプロピルアル フラックス Flux コ-ル75wt% 63%Sn Eutectic Solder with Rosin .. datasheet abstract.. |
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First line: Issue A00NAD3320 Date issue 15-Oct-02 Classification Change Renewal PRODUCT SPECIFICATION INFORMATION Product Abstract: .. 208B相当] More than 95% must be. [Equal to covered with solder. MIL-STD-202D-208B] uniformly. 半田 Solder 63Sn共晶半田,ロジン樹脂 25wt%,ロジンイソプロピルアル フラックス Flux コ-ル75wt% 63%Sn Eutectic Solder with Rosin .. datasheet abstract.. |
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First line: Issue A00NAD3303 Date issue 15-Oct-02 Classification Change Renewal PRODUCT SPECIFICATION INFORMATION Product Abstract: .. 208B相当] More than 95% must be. [Equal to covered with solder. MIL-STD-202D-208B] uniformly. 半田 Solder 63Sn共晶半田,ロジン樹脂 25wt%,ロジンイソプロピルアル フラックス Flux コ-ル75wt% 63%Sn Eutectic Solder with Rosin .. datasheet abstract.. |
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First line: TI380C30A INTEGRATED TOKEN-RING COMMPROCESSOR PHYSICAL-LAYER INTERFACE SPWS034 MARCH Single-Chip Token-Ring Solution IBM Abstract: .. 208b. Hold time, asynchronous signal SBBSY and SHLDA after SBCLK low to assure recognition on that cycle 10 10 ns. 212. Delay time, SBCLK low to SADH0‐SADH7, SADL0‐SADL7, SPH, and SPL valid 20 20 ns .. datasheet abstract.. |
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First line: TI380C30A INTEGRATED TOKEN-RING COMMPROCESSOR PHYSICAL-LAYER INTERFACE SPWS034 MARCH Single-Chip Token-Ring Solution IBM Abstract: .. 208b. Hold time, asynchronous signal SBBSY and SHLDA after SBCLK low to assure recognition on that cycle 10 10 ns. 212. Delay time, SBCLK low to SADH0‐SADH7, SADL0‐SADL7, SPH, and SPL valid 20 20 ns .. datasheet abstract.. |
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First line: TI380C30 INTEGRATED TOKEN-RING COMMPROCESSOR PHYSICAL-LAYER INTERFACE SPWS016A NOVEMBER REVISED JULY Expandable LAN-Subsystem Abstract: .. 208b. Hold time, asynchronous signal SBBSY and SHLDA after SBCLK low to assure recognition on that cycle 10 10 ns. 212. Delay time, SBCLK low to SADH0 ‐ SADH7, SADL0 ‐ SADL7, SPH, and SPL valid 20 20 ns .. datasheet abstract.. |
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First line: TI380C27 DUAL-PROTOCOL COMMPROCESSOR SPWS014A APRIL REVISED MARCH IEEE Token-Ring Network Compatible IEEE Abstract: .. 208b. Hold time, asynchronous signal SBBSY and SHLDA after SBCLK low to assure recognition on that cycle 10 10 ns. 212. Delay time, SBCLK low to SADH0 ‐ SADH7, SADL0 ‐ SADL7, SPH, and SPL valid 20 20 ns .. datasheet abstract.. |
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First line: TMS380C26 NETWORK COMMPROCESSOR SPWS010AAPRIL 1992REVISED MARCH IEEE Token-Ring Network Compatible IEEE Blue Abstract: .. 208b. Hold of asynchronous signal SBBSY and SHLDA after SBCLK low to guarantee recognition on that cycle 15 ns. 212 Delay from SBCLK low to SADH0‐SADH7, SADL0‐SADL7, SPH, and SPL valid 25 ns. 224a Delay .. datasheet abstract.. |
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First line: TI380C25 TOKEN-RING COMMPROCESSOR SPWS012 JANUARY IEEE Token-Ring Network Compatible Compatible With TI380FPA Abstract: .. 208b. Hold time, asynchronous signal SBBSY and SHLDA after SBCLK low to assure recognition on that cycle 10 10 ns. 212. Delay time, SBCLK low to SADH0 ‐ SADH7, SADL0 ‐ SADL7, SPH, and SPL valid 20 20 ns .. datasheet abstract.. |
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First line: This file catalog No.S21E-2. No.S21E2.pdf PYROELECTRIC INFRARED SENSOR SENSOR MODULE PYROELECTRIC INFRARED Abstract: .. Conform to MIL-STD-202F chapter 208B. Immerse in rosin flax and Immerse up to 2.0 to 2.5mm from can case. in solder bath of 230T5D for 5T0.5sec. Test Conditions. After completion of testing, leave .. datasheet abstract.. |
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First line: High Performance Decryption Cores CS5250-80 Virtual Components Converging World CS5250-80 series decryption Abstract: .. 208b. 181c. CS5260XV 549 4 44 91 264. CS5270XV 778 10 11 77 896. CS5280XV 4626 100 1 68 8704. a .. datasheet abstract.. |
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First line: Abstract: .. Conform to MIL-STD-202F chapter 208B. Immerse in rosin flax and Immerse up to 2.0 to 2.5mm from can case in. solder bath of 230T5D for 5T0.5 s. Test Conditions Criteria. Item. High Temperature. Low .. datasheet abstract.. |
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First line: SLWS129A GC2011A 3.3V DIGITAL FILTER CHIP DATASHEET March Information provided Graychip believed Abstract: .. Full Half None Dual 32 208B 2E00 008B 2E00 2000 46 HR. Cascaded 64 208B 2E28 008B 2E00 5E00 62. Even Dual 64 208B 2E12 008B 2E12 2000 46. Cascaded 128 208B 2E28 008B 2E12 5E00 62. Odd Dual 63 208B 2E91 008B 2E91 .. datasheet abstract.. |
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First line: Product Numerical Index Page Type Description 54-001 54-002 54-003 54-004 54-005 54-006 Abstract: .. . . . R13−208B−02−BG−B− 1 54−529 . . . . . . R13−208B−02−BG−N− 1 54−526 . . . . . . R13−208B−02−BR−B− 1 54−527 . . . . . . R13−208B−02−BR−N− 1 54−531 . . . . . . R13−208B−02−BU−B− 1 54−530 . . . . . . R13−208B .. datasheet abstract.. |
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First line: PYROELECTRIC INFRARED SENSOR SENSOR MODULE Cat.No.S21-5 No.S21-5webPDF S21J5.pdf IRA-E700 IRA-E900 Abstract: .. MIL‐STD‐202F試験方法208Bに準ずる?ロジンフラックスに浸した後、230±5°Cのはんだ槽に端子根元2~?2.5mmの位置まで5±0.5秒間浸漬 試験条件 各試 .. datasheet abstract.. |
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First line: Programmable Peripheral Application Note Three-Chip Feature Phone Steve Torp Motorola Semiconductor Karen Abstract: .. 0162 0163 208b 18 ce 30 1e DISPLAY: LDY #$301E NORMAL MODE. 0164 208f bd 30 a1 JSR TD150 TIME DELAY. 0165 2092 bd 30 b3 JSR LINE2 USE LINE 2. 0166 2095 bd 30 8a JSR PDOD DISPLAY MODE. 0167 2098 bd 30 a1 JSR TD150 .. datasheet abstract.. |
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First line: XDS522A Emulation System Users Guide Digital Signal Processing Solutions Printed U.S.A. August Abstract: .. 1: Fetch NoCycle 208B 6E89 .. .. AND *AR1. 0: Fetch NoCycle 208C 9080 .. .. SACL * TRACE. Program address/data for the POPD instruction. Data address/data for the POPD instruction. b Samples .. datasheet abstract.. |
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First line: XDS522A Emulation System Users Guide Digital Signal Processing Solutions Printed U.S.A. August Abstract: .. 1: Fetch NoCycle 208B 6E89 .. .. AND *AR1. 0: Fetch NoCycle 208C 9080 .. .. SACL * TRACE. Program address/data for the POPD instruction. Data address/data for the POPD instruction. b Samples .. datasheet abstract.. |
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First line: Hitachi Electric Hitachi Renesas Technology Abstract: .. H'A400 208B. H'A400 208C IPRG. H'A400 208D. H'A400 208E IPRH. H'A400 208F. H'A400 2090 ICR0 NMIL — — — — — —NMIE. H'A400 2091 — — — — — —IRQE — H'A400 2092 ICR1 IRQ71S IRQ70S IRQ61S IRQ60S IRQ51S IRQ50S .. datasheet abstract.. |
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771 Pages
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First line: Hitachi SuperH RISC engine SH7622 Hardware Manual ADE-602-212A Rev. Hitachi Ltd. Cautions Abstract: .. H'A400 208B. H'A400 208C IPRG. H'A400 208D. H'A400 208E IPRH. H'A400 208F. H'A400 2090 ICR0 NMIL — — — — — — NMIE. H'A400 2091 — — — — — — IRQE — H'A400 2092 ICR1 IRQ71S IRQ70S IRQ61S IRQ60S IRQ51S IRQ50S .. datasheet abstract.. |
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