500 MILLION PARTS FROM 12000 MANUFACTURERS

DATASHEET SEARCH ENGINE

Top Results

Part Manufacturer Description Datasheet BUY
DRA622CIZKKQ1 Texas Instruments 640-BGA visit Texas Instruments
DRA622CIZKKRQ1 Texas Instruments 640-BGA visit Texas Instruments
TMS320C28343ZEPQ Texas Instruments Delfino Microcontroller 256-BGA visit Texas Instruments
TMS320C28342ZEPQ Texas Instruments Delfino Microcontroller 256-BGA visit Texas Instruments
TMS320C28346ZEPQ Texas Instruments Delfino Microcontroller 256-BGA visit Texas Instruments
AM1707DZKBT3 Texas Instruments Sitara Processor 256-BGA visit Texas Instruments

202 ball bga

Catalog Datasheet MFG & Type PDF Document Tags

BGA PACKAGE TOP MARK intel

Abstract: 144 bga , Easy BGA Package Schematics: Silicon Daisy Chain Evaluation Units (E3 and F3 connected on the Ball , View - Ball Side Up daisy 2 Easy BGA Mechanical Specification 3.0 Easy BGA Package , Preliminary Mechanical and Shipping Media Information for Easy BGA Packages May 2000 Document , respective owners. Easy BGA Mechanical Specification Contents 1.0 Easy BGA Package Drawing and Dimensions . 1 2.0 Easy BGA Package Schematics: Silicon
Intel
Original

639X

Abstract: LGA 1150 (P) Q.ty per Reel Table BGA 10 x 12 mm Ball Grid Array 24 mm 16 mm 1500 5 , Table 5. Carrier Tape Mechanical Data for BGA (Ball Grid Array) and LGA (Land Grid Array) 10 x 12 mm , hole. Figure 4. Carrier Tape Outline for BGA (Ball Grid Array) and LGA (Land Grid Array) 10 x 12 mm , 5. Carrier Tape Outline for LFBGA (Low Profile Fine Pitch BGA) 8 x 9 mm Ko D BALL "A1" Po , LFBGA (Low Profile Fine Pitch BGA) 7 x 7 mm Ko D T BALL "A1" Po REFERENCE E P2 F
STMicroelectronics
Original

bga 1296

Abstract: LVDSEXT25 Packages (VQ) TQFP Packages (TQ) Chip Scale Packages - wire-bond chip-scale BGA (0.8 mm ball spacing) BGA Packages (BG) - wire-bond standard BGA (1.27 mm ball spacing) 196 260 260 316 316 316 404 404 404 404 404 , fine-pitch thin BGA (1.0 mm ball spacing) FGA Packages (FG) - wire-bond fine-pitch BGA (1.0 mm ball spacing) FFA Packages (FF) - flip-chip fine-pitch BGA (1.0 mm ball spacing) BFA Packages (BF) - flip-chip fine-pitch BGA (1.27 mm ball spacing) XILINX FPGA PRODUCT SELECTION MATRIX CLB Resources Max
Xilinx
Original

INTEL 28F640

Abstract: BGA PACKAGE TOP MARK intel . 3 Very-Thin, Fine-Pitch, Ball Grid Array (VF BGA) Package Daisy Chain Schematics for GE28FSDCR46 . 4 Very-Thin, Fine-Pitch, Ball Grid Array (VF BGA) Package Drawing and Dimensions for Daisy Chain , . 1 Very-Thin, Fine-Pitch, Ball Grid Array (VF BGA) Package Construction . 1 µBGA , Flash Memory Revised Section 2.4, Very-Thin, Fine-Pitch, Ball Grid Array (VF BGA) Package Drawing and , Construction provides excellent Reliability Very-Thin, Fine-Pitch, Ball Grid Array (VF BGA) Package
Intel
Original
28F800B3 28F160B3 28F016B3 28F160C3 28F320C3 INTEL 28F640 BGA PACKAGE TOP MARK intel vf bga 298161 28F160C18 INTEL 28F640 application PS0213 28F008S3 RD33704SW RD33708SW RD33716SW

LGA 1150

Abstract: (P) Q.ty per Reel Table BGA 10 x 12 mm Ball Grid Array 24 mm 16 mm 1500 5 , components sizes. 4/15 CSP Tape & Reel Table 5. Carrier Tape Mechanical Data for BGA (Ball Grid Array , measured as true position of pocket, not pocket hole. Figure 4. Carrier Tape Outline for BGA (Ball Grid , Outline for LFBGA (Low Profile Fine Pitch BGA) 8 x 9 mm Ko D BALL "A1" Po REFERENCE T E , LFBGA (Low Profile Fine Pitch BGA) 7 x 7 mm Ko D T BALL "A1" Po REFERENCE E P2 F
STMicroelectronics
Original
LGA 1150
Abstract: (P) Q.ty per Reel Table BGA 10 x 12 mm Ball Grid Array 24 mm 16 mm 1500 5 , . Carrier Tape Mechanical Data for BGA (Ball Grid Array) and LGA (Land Grid Array) 10 x 12 mm mm inches , Outline for BGA (Ball Grid Array) and LGA (Land Grid Array) 10 x 12 mm Ko D BALL "A1" REFERENCE , 5. Carrier Tape Outline for LFBGA (Low Profile Fine Pitch BGA) 8 x 9 mm Ko D BALL "A1" Po , Profile Fine Pitch BGA) 7 x 7 mm Ko D T BALL "A1" Po REFERENCE E P2 F Bo K1 W STMicroelectronics
Original

202 ball bga

Abstract: excluding the 320ball BGA and 432-ball BGA, which specify a maximum allowable junction temperature of 140 , °C (140°C for the 320-ball BGA and 432-ball BGA), refer to the following hints to reduce overall power , -pin MQFP 208-pin 240-pin 304-pin caBGA 49-ball 100-ball 144-ball 208-ball 208-ball * fpBGA 256-ball 256-ball * 388-ball 388-ball * 272-ball 272-ball * 320-ball BGA 388-ball 388-ball * 432-ball 492-ball 492-ball , 31 29 26 26 19 22.6 14 36 44 29 29 28 12 10 10 9.8 68 39 25 22 19.1 20.6 15.4 20.2 15.1 19 15 11.2 16
Lattice Semiconductor
Original
202 ball bga JESD51 G38-87 G42-88

13M-pixel

Abstract: 202 ball bga 18 DIRI DP[9] 8 17 VDDS DP[10] 9 E DP[4] 1 42-Ball BGA, 3.5 x 4.5mm, .5mm pitch (Top , PWS0 S1 S0 42-Ball BGA, 3.5 x 4.5mm, .5mm pitch (Top View) VDDA 16 DP[12] S0 15 G , 330.0 1.5 13.0 20.2 178.0. 16.4 22.4 15.9 ~ 19.4 Figure 9. BGA Tape and Reel , www.fairchildsemi.com 14 Figure 11. 42-Ball, Ball Grid Array (BGA) Package Order Number Operating Temperature , 1.65 to 3.6V 14kV 32-Terminal MLP 42-Ball USS-BGA FIN212ACMLX FIN212ACGFX The FIN212AC
Fairchild Semiconductor
Original
13M-pixel dsi LCD driver DP1211 30 pin flex cable lcd 5M cmos camera ipc-SM-782 MO-195

DP1211

Abstract: 337 BGA footprint DP[12] 11 PLL1 12 DP[12] N/C PLL1 PLL0 S1 S0 42-Ball BGA, 3.5 x 4.5mm, .5mm , 11. 42-Ball, Ball Grid Array (BGA) Package Order Number FIN212ACGFX Operating Temperature Range , 1.65 to 3.6V 14kV 32-Terminal MLP 42-Ball USS-BGA FIN212ACMLX FIN212ACGFX Description The FIN212AC , ground. BGA: all GND pads. MLP: Pin 29 & GND PAD must be grounded. No connect. (Do not connect to GND or , for serial I/O. Power supply for core. All GND pins must be connected to ground. BGA: all GND pads
Fairchild Semiconductor
Original
337 BGA footprint

577ns

Abstract: PLL0 S1 S0 42-Ball BGA, 3.5 x 4.5mm, .5mm pitch (Top View) 32-pin MLP, 5 x 5mm, .5mm pitch , VDDA N/C DIRI G DP[12] N/C PWS1 PWS0 S1 S0 42-Ball BGA, 3.5 x 4.5mm, .5mm , 11. 42-Ball, Ball Grid Array (BGA) Package Packing Method Tape & Reel Order Number FIN212ACGFX , 1.65 to 3.6V 14kV 32-Terminal MLP 42-Ball USS-BGA FIN212ACMLX FIN212ACGFX Description The FIN212AC , ground. BGA: all GND pads. MLP: Pin 29 & GND PAD must be grounded. No connect. (Do not connect to GND or
Fairchild Semiconductor
Original
577ns

202 ball bga

Abstract: XC2S15 182 176 176 176 176 202 263 289 329 196 260 284 Chip Scale Packages - wire-bond chip-scale BGA (0.8 mm ball spacing) FGA Packages (FT) - wire-bond fine-pitch thin BGA (1.0 mm ball spacing) FGA Packages (FG) - wire-bond fine-pitch BGA (1.0 mm ball spacing) Serial PROM Family Block RAM (kbits , NA NA NA NA NA NA 84 86 114 120 120 NA NA NA NA NA NA 182 202 263 289 329 86 132 176 196 260 , /O's 182 202 263 289 329 146 146 146 146 146 86 132 176 196 260 284 132 140 140 140 140 60 60 92
Xilinx
Original
XC2S50E XC2S15 XC2S50 XC2S150 XC2S200 XC2S30 PINS XC2S100E XC2S150E XC2S200E XC2S300E

BGA-56 DATASHEET

Abstract: mini ball corner 4-27 ® pkg-3.7-04/99 Low Profile BGA Dimensions Ball Count Ball Pitch Row Array Body , Mini Array BGA Dimensions Ball Count Ball Pitch Row Array Body Size Package Height 40 , Rows 11mm x 11mm 1.4mm 4-29 ® pkg-3.7-04/99 Mini Array BGA 40/.5 Top View A1 BALL , 4-31 ® pkg-3.7-04/99 Mini Array BGA 56/.5 Side View Top View 1.24 ±0.10 A1 BALL PAD , 4-32 Packaging 0.75 REF 0.50 pkg-3.7-04/99 Mini Array BGA 64/.8 Top View A1 BALL PAD
Atmel
Original
BGA-56 DATASHEET mini ball corner cpga dimensions BGA-64 pad PQFP 132 PACKAGE DIMENSION PQFP die size

QFP Package 128 lead .5mm

Abstract: QFP 128 lead .5mm socket base . 4. Place BGA package (solder ball side down) into the socket. NOTE: BGA orientation into socket is critical. 5. Place the compession plate (D), on top of the BGA package, orientation is not , 0.5mm Description: BGA to QFP package converter 484 position BGA surface mount GHz BGA socket , commercial practices (1) per Mil-STD-202, method 107, test condition A (2) per Mil-STD-202, method 208 , . Compression Screw Socket Top Assembly E F Socket Lid Compression plate D C BGA Package
Ironwood Electronics
Original
A54SX72A-FG484 SI-SX72-ACQ256SFG484 QFP Package 128 lead .5mm QFP 128 lead .5mm BGA reflow guide A54SX72A-CQ256 BGA 256 PACKAGE thermal resistance 26X26 27X27 PC-BGA/QFP-SX72A-Z-01 FR4/G10 72A-CQ256

234 N02

Abstract: ) for Fast Counters, State Machines, Address Decoders, etc. - PCB Efficient Ball Grid Array (BGA , I/O 192 I/O 192 I/O 388 BGA - 288 I/O 288 I/O *1.0mm ball pitch Fine Pitch BGA 3 , multiplexed with TOE. 18 Specifications ispLSI 5384VA 208-Ball BGA Signal Locations Signal GOE0, GOE1 , connected to any active signals, VCC or GND. 208-Ball BGA I/O Locations (Sorted by I/O) I/O # 0* 1 2 3 4 , multiplexed with CLK3 and I/O 0 is multiplexed with TOE. 19 Specifications ispLSI 5384VA 208-Ball BGA
Lattice Semiconductor
Original
234 N02 208-PQFP/5384V 208-PQFP 208-BGA 272-BGA 388-BGA 5384VA-125LQ208

rd33708

Abstract: Intel H4 socket Media and Socket Ordering Information for Easy BGA Package. 8 Note: Please refer to , E F b G H 1 2 3 4 5 6 7 8 Top View - Ball Down 9 10 11 12 D Bottom View - Ball Up A A1 A2 Y 8068_01 NOTE: Specific ball population patterns may , Ball Standoff A1 0.30 0.35 0.40 0.012 0.014 0.016 Package Body Thickness A2 0.92 0.97 1.02 0.036 0.038 0.040 Ball (Lead) Width b 0.325 0.40 0.475
Intel
Original
28F1602C3 28F1604C3 28F3202C3 28F3204C3 12R-0812-213 rd33708 Intel H4 socket intel h2 socket 806801 Intel Stacked CSP US048631 US048681

SG-BGA-6064

Abstract: 6064 aluminium data sheet Top View GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB , required Compression plate distributes forces evenly 22.225mm Ball guide prevents over compression of , : Shoulder screw, 18-8 SS, 0-80 fine thread. 10 8 Ball Guide: Kapton polyimide. 8 2 , base nut: 18-8 Stainless steel, 0-80 fine thread. 7 6 10 5 11 Customer's BGA IC , : BGA pattern is not symmetrical with respect to the mounting holes. Orientation Mark
Ironwood Electronics
Original
SG-BGA-6064 6064 aluminium data sheet 5M-1994

LVDSEXT-25

Abstract: BLVDS-25 Packages (HQ) Chip Scale Packages - wire-bond chip-scale BGA (0.8 mm ball spacing) 88 92 92 94 94 BGA Packages (BG) - wire-bond standard BGA (1.27 mm ball spacing) 196 260 260 316 316 316 404 404 404 404 404 , Packages (FG) - wire-bond fine-pitch BGA (1.0 mm ball spacing) FFA Packages (FF) - flip-chip fine-pitch BGA (1.0 mm ball spacing) BFA Packages (BF) - flip-chip fine-pitch BGA (1.27 mm ball spacing , 202 256 330 362 402 402 402 202 278 204 348 396 564 852 88 120 200 264 432 528 624 720 912 1104 824
Xilinx
Original
XC2V250 XC2V500 XC2VP20 XC2VP50 XC2V80 XC2V1500 LVDSEXT-25 BLVDS-25 LVDSEXT25 XCV1600E BGA 31 x 31 mm XC2V40

SG-BGA-6143

Abstract: 16X16 GHz BGA Socket - Direct mount, solderless Features Top View Directly mounts to target PCB , required Compression plate distributes forces evenly 22.225mm Ball guide prevents over compression , a silicone rubber (63.5 degree angle). Thickness = 0.75mm. 6 Ball Guide: Kapton polyimide , 's BGA IC SG-BGA-6143 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 , : BGA pattern is not symmetrical with respect to the mounting holes. Orientation Mark
Ironwood Electronics
Original
16X16
Abstract: +85°C â'"40°C to +100°C 456-ball Fine Pitch BGA XC2S300E C = Commercial 256-ball Fine Pitch BGA XC2S200E Temperature Range (TJ ) 676-ball Fine Pitch BGA XC2S400E XC2S600E , 37,000 - 100,000 20 x 30 600 202 86 38,400 40K XC2S150E 3,888 52,000 - 150 , 256 456 676 Type Device 144 Plastic TQFP Plastic PQFP Fine Pitch BGA Fine Pitch BGA Fine Pitch BGA Code TQ144 PQ208 FT256 FG456 FG676 XC2S50E -6 C Xilinx
Original
DS077-1 DS077-2 DS077-3 DS077-4

5000VA

Abstract: A09 N03 16 512 - 144 I/O 192 I/O 288 I/O *1.0mm ball pitch Fine Pitch BGA 3 , 5384VA 208-Ball BGA Signal Locations Signal Ball GOE0, GOE1 P9, P10 TOE / I/O0 K1 , E15, C14 1. NCs are not to be connected to any active signals, VCC or GND. 208-Ball BGA I/O , ispLSI 5384VA 208-Ball BGA I/O Locations (Sorted by Ball) I/O # Ball I/O # Ball I/O # , Specifications ispLSI 5384VA 272-Ball BGA Signal Locations Signal GOE0, GOE1 Ball V11, U11 TOE / I/O 0
Lattice Semiconductor
Original
5000VA A09 N03 b20 p03 T14 N03 283 g23 5256VA 208-P 5384VA-125LB208 208-B 5384VA-125LB272 272-B 5384VA-125LB388
Showing first 20 results.