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Part Manufacturer Description Datasheet BUY
UCC1806N Texas Instruments 1A SWITCHING CONTROLLER, 1000kHz SWITCHING FREQ-MAX, PDIP16, PLASTIC, DIP-16 visit Texas Instruments
UCC1806J Texas Instruments Low Power, Dual Output, Current Mode PWM Controller 16-CDIP -55 to 125 visit Texas Instruments
AM1806BZCED4 Texas Instruments Sitara Processor: ARM9, LPDDR, DDR2, Display 361-NFBGA -40 to 90 visit Texas Instruments
UCC1806Q Texas Instruments 1A SWITCHING CONTROLLER, 1000kHz SWITCHING FREQ-MAX, PQCC20, PLASTIC, LCC-20 visit Texas Instruments
UCC1806LQMLV Texas Instruments 0.5A SWITCHING CONTROLLER, 1000kHz SWITCHING FREQ-MAX, CQCC20, CERAMIC, LCC-20 visit Texas Instruments
UCC1806JQMLV Texas Instruments 0.5A SWITCHING CONTROLLER, 1000kHz SWITCHING FREQ-MAX, CDIP16, CERAMIC, DIP-16 visit Texas Instruments

1806 footprint dimension

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1806 footprint dimension

Abstract: size 1806 footprint product size code; see Fig.10 DIMENSION PRODUCT SIZE CODE 0603 0805 1206 1806 Ao 1.1 ±0.1 1.6  , . Supplied in four standard sizes (0603, 0805, 1206 and 1806), they have impedances between 30 and 1 000 Q at , 0805: 2.0 x 1.25 mm 1206: 3.2 x 1.60 mm 1806: 4.5 x 1.60 mm. Material 4S4 4S7 Impedance value , Fig.9 CASE SIZE FOOTPRINT DIMENSIONS (mm) A B C 0603 2.1 0.7 0.7 0805 2.6 1.0 1.0 1206 4.4 2.2 1.35 1806 6.0 3.0 1.35 2000 Apr 20 726 -_L ^ i . Philips Components Product specification
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1806 footprint dimension

Abstract: MLS1206-4S7-102 size code; see Fig.10 PRODUCT SIZE CODE DIMENSION 0603 0805 1206 1806 A0 1.1 ±0.1 , four standard sizes (0603, 0805, 1206 and 1806), they have impedances between 30 and 1 000 at 100 , 1806: 4.5 × 1.60 mm. Material 4S4 4S7 Impedance value Expressed in ohms () First two digits are , . 4S4 2001 Jan 20 SIZE 1806 at 100 MHz Z () RDC MAX. () I MAX. (mA) 80 0.1 , of solder lands. Table 1 Solder land dimensions; see Fig.9 FOOTPRINT DIMENSIONS (mm) CASE
Philips Components
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Abstract: ] -!- - (2) .125 [318] .350 [8.89] Footprint Dimension Chart .100 [2.54] Dimensions Ports , 110(2 79] â'" - 110 [279] Footprint Dimension Chart Ports A B 2 (1/1) 16 .450 , StackJack Harmonica Jacks â'¢ Unshielded ! Eight-Contact, ! Eight-Position Ports Dimension A 2 , 16(8/8) PC-Mount StackJack Harmonica Jacks 73 Series â'¢ Unshielded â'¢ Footprint , . Dimension Chart Ports Dimension A B 2(1/1) .679 4 (2/2) 6 (3/3) 8 (4/4) 1.229 1.779 -
OCR Scan

HI1206N101R-00

Abstract: 1806 footprint filtering for densely packed PCB designs. The small footprint enables placement very close to troublesome , frequency characteristics superior to those of similar products. Features: ·Small footprint ·Excellent , High Current Chips (Continued) HI1206N101R-00 HI1206P121R-00 HI1806T600R-00 0.040 3,000 4516 (1806 , -00 MI1806J800R-00 MI1812K121R-00 4516 (1806) 4532 (1812) 500 150 82 0.060 2,000 60 92 , -00 LI1806E101R-00 LI1806C151R-00 LI1812D121R-00 4532 (1812) 3225 (1210) 4516 (1806) 3216 (1206) 2012 (0805) 220
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1806 footprint E4991A HP8753 HP43961A HP16193A HP16200A PM2811

HI1206N101R-00

Abstract: 1806 footprint dimension EMI filtering for densely packed PCB designs. The small footprint enables placement very close to , versus frequency characteristics superior to those of similar products. Features: · Small footprint , Current Chips 4516 (1806) HI0603P600R-00 1608 (0603) 60 90 95 0.040 3,000 , MI1806J800R-00 4516 (1806) 80 129 131 0.150 1,000 MI0603M121R-00 120 195 155 , DA1206C121R-00 120 181 151 0.200 300 LI1806E800R-00 4516 (1806) 80 117 124
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1806 footprint dimension mi0603 LI0805H400R-00 MI0805M221R-00 dm1612x560r-00 HI2220T101R-00 BROCH0009

MLP0603-601

Abstract: ferroxcube MLP0805-300 sizes (0402, 0603, 0805, 1206, 1210, 1806 and 1812), they have impedances between 6 and 2 000 at 100 , highreliability · Standard EIA and EIAJ sizes: 0402, 0603, 0805, 1206, 1210, 1806 and 1812 · High impedance per , × 0.8 mm 0805: 2.0 × 1.25 × 0.9 mm 1206: 3.2 × 1.6 × 1.1 mm 1210: 3.2 × 2.5 × 1.3 mm 1806: 4.5 × , 1.3 ± 0.20 0.5 ± 0.30 50 1806 4.5 ± 0.25 1.6 ± 0.20 1.6 ± 0.20 0.5 ± 0.30 55 , -4S7-102 MLS0805-4S7-152 30 ± 25% 1806 200 200 26 ± 25% 1210 0.5 0.6 2000 ± 25% 1206
Ferroxcube
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MLP0603-601 ferroxcube MLP0805-300 MLP0805-102 MLS0805-4S4-202 MLS1206-4S4-151 MLS1206-4S7-122

MLP0603-501

Abstract: MLS0603-4S7-800 dimensions; see Fig.5 PRODUCT SIZE CODE DIMENSION 0402 0603 0805 1206 1210 1806 1812 , standard sizes (0402, 0603, 0805, 1206, 1210, 1806 and 1812), they have impedances between 6 and 2 000 â , magnetic path and highreliability â'¢ Standard EIA and EIAJ sizes: 0402, 0603, 0805, 1206, 1210, 1806 , × 1.25 × 0.9 mm 1206: 3.2 × 1.6 × 1.1 mm 1210: 3.2 × 2.5 × 1.3 mm 1806: 4.5 × 1.6 × 1.6 , ≠28 1210 3.2 ± 0.20 2.5 ± 0.20 1.3 ± 0.20 0.5 ± 0.30 ≠50 1806 4.5
Ferroxcube
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MLP0603-501 MLS0603-4S7-800 MLN1206-122

MLS1206-4S7-122

Abstract: walkdisc .5 PRODUCT SIZE CODE DIMENSION 0402 0603 0805 1206 1210 1806 1812 A 178 178 , standard sizes (0402, 0603, 0805, 1206, 1210, 1806 and 1812), they have impedances between 6 and 2 000 at , highreliability · Standard EIA and EIAJ sizes: 0402, 0603, 0805, 1206, 1210, 1806 and 1812 · High impedance per , mm 1210: 3.2 × 2.5 × 1.3 mm 1806: 4.5 × 1.6 × 1.6 mm 1812: 4.5 × 3.2 × 1.5 mm. Impedance value , 1210 3.2 ± 0.20 2.5 ± 0.20 1.3 ± 0.20 0.5 ± 0.30 50 1806 4.5 ± 0.25 1.6 ± 0.20
Ferroxcube
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walkdisc MLS0805-4S7-301 MLS0805-4S7 MLP1812-700 MLS0805-4S7-401 MLS0603-4S7-600

1806 footprint

Abstract: filtering for densely packed PCB designs. The small footprint enables placement very close to troublesome , frequency characteristics superior to those of similar products. Features: ·Small footprint ·Excellent , ,000 4516 (1806) 4532 (1812) 60 102 107 0.010 6,000 100 175 225 0.004 10,000 80 , -00 LI1206H151R-00 LI1806E800R-00 LI1806E101R-00 LI1806C151R-00 4516 (1806) 3216 (1206) 2012 (0805) 1608 (0603 , (0805) 3216 (1206) 3225 (1210) 4030 (1612) 4516 (1806) 4532 (1812) Land Pattern for Reflow Soldering
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HI2220R301R-00

Abstract: HR2220P601R-00 filtering for densely packed PCB designs. The small footprint enables placement very close to troublesome , frequency characteristics superior to those of similar products. Features: ·Small footprint ·Excellent , ,000 4,000 6,000 4516 (1806) 4532 (1812) 60 80 100 5650 (2220) 100 150 180 170 250 270 300 400 550 102 , 300 3216 (1206) 31 52 120 150 4516 (1806) 80 100 150 50 90 205 454 120 156 279 286 60 112 167 207 248 , (0805) 3216 (1206) 3225 (1210) 4030 (1612) 4516 (1806) 4532 (1812) Land Pattern for Reflow Soldering
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HI2220R301R-00 HR2220P601R-00 HI1812V101R-00 HI0805O121R-00 MI0603J600R-00

HI0805O121R-00

Abstract: HZ0603B102R-00 filtering for densely packed PCB designs. The small footprint enables placement very close to troublesome , frequency characteristics superior to those of similar products. Features: ·Small footprint ·Excellent , ,000 4516 (1806) 4532 (1812) 60 102 107 0.010 6,000 100 175 225 0.004 10,000 80 , 275 140 0.100 1,500 150 4516 (1806) 173 123 0.150 800 26 38 40 , ) 4516 (1806) 4532 (1812) Land Pattern for Reflow Soldering G D L 8.64 (0.340) 5.70 (0.224
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HZ0603B102R-00
Abstract: filtering for densely packed PCB designs. The small footprint enables placement very close to troublesome , versus frequency characteristics superior to those of similar products. Features: â'¢Small footprint , ) DM1612X560R-00 4131 (1612) 56 90 100 0.004 10,000 HI1806T600R-00 4516 (1806) 60 , ) 3216 (1206) Steward www.steward.com 2012 (0805) 3216 (1206) 4516 (1806) North , (0.084) 4.06 (0.160) 4516 (1806) 4.50 + 0.25 1.60 + 0.25 1.60 + 0.25 0.51 + 0.25 (0.177 + Steward
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Abstract: footprint. Spectrum Control surface mount EMI filters are ideal for a wide range of PCB applications , electrode structure 2 terminal variations available s Performance Small footprint and low residual , ), 1206 (3216), 1806 (4516) Tape and reel packaging Non-polar, surface mountable s Performance Small footprint and low residual inductance provides superior filtering at higher frequencies Tape and reel packaging Non-polar, surface mountable Compact footprint s Design flexibility Simple structure and Spectrum Control
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Abstract: filtering for densely packed PCB designs. The small footprint enables placement very close to troublesome , frequency characteristics superior to those of similar products. Features: ·Small footprint ·Excellent , High Current Chips (Continued) HI1206N101R-00 HI1206P121R-00 HI1806T600R-00 0.040 3,000 4516 (1806 , -00 MI1806J800R-00 MI1812K121R-00 4516 (1806) 4532 (1812) 500 150 82 0.060 2,000 60 92 , -00 LI1806E101R-00 LI1806C151R-00 LI1812D121R-00 4532 (1812) 3225 (1210) 4516 (1806) 3216 (1206) 2012 (0805) 220 Steward
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hz0603b102r-00

Abstract: filtering for densely packed PCB designs. The small footprint enables placement very close to troublesome , frequency characteristics superior to those of similar products. Features: · Small footprint · Excellent , Current Chips (Continued) HI1206N101R-00 HI1206P121R-00 HI1806T600R-00 4516 (1806) 100 120 60 75 4532 , 70 90 100 300 500 600 4516 (1806) 4532 (1812) 80 120 271 262 275 55 38 45 104 142 146 142 150 250 129 , -00 LI1806E101R-00 LI1806C151R-00 LI1812D121R-00 4532 (1812) 3225 (1210) 4516 (1806) 3216 (1206) 2012 (0805) 220
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1806 footprint dimension

Abstract: ceramic capacitor footprint 0402 dimension Operating Temp.( C ) PACKAGE STYLE AND PINNING (Side View) 11.02 [0.434] RECOMMENDED FOOTPRINT , 0.25 [0.010] 2.54 [0.100] 1.00 [0.039] FOOTPRINT DETAILS 5° 1.13 [0.044] Pin 10.16 , Vadj 10 ON/OFF TAPINGREEL DIMENSIONS Taping dimension: 1.50 [0.059] 8.20 [0.323] 10.20 , ] 11.50 [0.453] 2.00 [0.079] 12.40 [0.488] 16.00 [0.630] Taping reel dimension: 1.50 [0.059 , 52.9 10.0V 9.0V 18.84 180.6 76.3 11.0V 4.47 370 111 11.5V 1.61 635
MORNSUN
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ceramic capacitor footprint 0402 dimension Capacitor 22uF 15v SMD footprint 20MHZ transistor SMD LOA K78XXT-500 K7803T-500 K7805T-500 K7809T-500 K7812T-500 K7815T-500

IHLP2525CZER68

Abstract: 68nf x2 footprint layouts along with different copper area and thermal resistance has been measured. The layouts , thermal impedance is only 22% higher than the medium and large footprint layouts, indicating that space , minimum footprint of 0.1 square inch, if used on a 4 layer board, can produce 44°C/W thermal resistance , footprint, only about 0.1 square inch (of 3 ounces of) copper was used on the top or footprint layer, and this layer had no vias to connect to the 3 other layers. For the Medium footprint, about 0.7 square
Sipex
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SP7653 SP7653ER IHLP2525CZER68 68nf x2 50K1 IHLP2525CZER2R2M01 SD101AWS SP6132 CW06032742F CRCW06031002F CRCW06035R11F CRCW1210464RJ K24C/M
Abstract: 10.0V 9.0V 18.84 180.6 76.3 11.0V 4.47 370 111 11.5V 1.61 635 134.1 , STYLE AND PINNING MECHANICAL DIMENSIONS RECOMMENDED FOOTPRINT 10.16[0.400] 5.08[0.200] 5.08 , 11.02[0.434] 10.16[0.400] 0.25±0.10 [0.010±0.004] 15.24±0.50 [0.60±0.020] FOOTPRINT , ] ON/OFF Vadj Note: grid:2.54*2.54mm TAPINGREEL DIMENSIONS Taping dimension: â1.50 [0.059 , [0.630] Taping reel dimension: â1.50 [0.059] 7.65 [0.301] 29.40 [1.157] â100.00[3.937 MORNSUN
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T-500 B/0-2012

2SN-DC24V

Abstract: COMPACT PC BOARD POWER RELAY JW-RELAYS 12.8 .504 UL File No.: E43028 CSA File No.: LR26550 · Miniature package with universal terminal footprint · High dielectric withstanding for transient protection: 10,000 V surge in ms between coil and contact · Sealed construction · Class B coil , 2 Form A 2 Form C m m inch .787 20 u n r 3.6 0.9 .035 .142 General Dimension , 0 .8±0.1 ,031±.004 3. Plug-in socket .7 0 9 r 024 18±0.6 13±0.6 .512 r.0 2 4 13±0
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2SN-DC24V VDE0435 VDE0631 VDE0700

CM1812R600R-10

Abstract: CM3440Z171R-10 1612 1806 1812 1922 2021 2220 2520 2545 2722 3032 3312 3322 3421 3822 4545 4732 5022 , Dimension -10 = Lead Free Standard Catalog Part -11 to -99 = Non Standard or Custom Part Impedance , Material Type 00 = Legacy Part Contains Lead Minor Dimension Code Height or Length Variation , footprint · Excellent retention under bias · Superior impedance vs. frequency characteristics · Economical , CURRENT CHIP BEAD 56 75 79 1806 CHIP BEADS 1812 CHIP BEADS HI1812T800R-10 High Current
Laird Technologies
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CM1812R600R-10 CM3440Z171R-10 CM0805D900R-10 CM5441Z161R-13 CC2824B475R-10 28F0181-1SR-10 SIP-CAT-BOARDLEVELFERRITE-0708
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