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18-micron

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Abstract: mixed-signal ASICs are manufactured using Atmel's advanced two-level metal, 1.8-micron, lowpower CMOS process. ... OCR Scan
datasheet

4 pages,
168.92 Kb

voltage controlled oscillator smart parking circuit diagram atmel 1042 80C31 80C31 abstract
datasheet frame
Abstract: DEVICE SPECIFIC f 000975 CO-Y APPLIED MICRO CIRCUITS CORPORATION Q6000A Q6000A SERIES CMOS LOGIC ARRAYS FEATURES TECHNOLOGY Q6000A Q6000A Series arrays feature 1.8-micron silicon-gate CMOS with two-level metalization, offering high performance and up to 85% chip utilization. SIX ARRAY SIZES 1400 to 6200 equivalent gate densities are available in the Q6000A Q6000A Series. UP TO 154 I/O CAPABILITY The Q6000A Q6000A Series , applications. The AMCC Q6000A Q6000A Series arrays are fabricated using a state-of-the-art 1.8-micron ... OCR Scan
datasheet

8 pages,
455.93 Kb

synchronous counter using flip flip MSI IC decoder binary counters with D-flip flop amcc, qc 74 series logic gate 5502 power switching q6000a datasheet abstract
datasheet frame
Abstract: PDIP-16 standard along with our 3-micron SG3 process that became qualified in 1992. Bipolar is an 18-micron, 44V or ... Original
datasheet

18 pages,
85.49 Kb

MAX690CPA Ic 9148 MAX333 equivalent MAX232 mtbf max232 application MAX232 datasheet abstract
datasheet frame
Abstract: 18-micron, 44V or 12-micron, 24V Bipolar process. This process is used chiefly for precision references, op ... Original
datasheet

18 pages,
88.78 Kb

for MAX232 DG212CJ DG211CJ DG201ACJ MAX235 MAX252 8 pin op07 ic metal package op07 op 9115 msi 9121 maxim 9114 MAX9690 MAX422 9109 capacitor datasheet abstract
datasheet frame
Abstract: 18-micron, 44V or 12-micron, 24V bipolar process, used chiefly for precision references, op amps, and A/D ... Original
datasheet

23 pages,
125.02 Kb

ICM7218 7912 TO3 PACKAGE MAX8212 equivalent LTC902 icl8069 equivalent MAX202, MAX232 datasheet abstract
datasheet frame
Abstract: Bipolar is an 18-micron, 44V or 12-micron, 24V bipolar process, used chiefly for precision references, op ... Original
datasheet

23 pages,
138.49 Kb

MAX7219 equivalent MAX233 application notes MAX232cpe 9529 ICM7218AIPI MAX232CPE application sheet 9532 zener MAX724 equivalent DG302 to220 datasheet abstract
datasheet frame
Abstract: , and SG1.2 have become our future process standards. Bipolar Bipolar is an 18-micron, 44V or 12-micron ... Original
datasheet

24 pages,
154.57 Kb

MAX477 equivalent MAX235 mask st 9548 max785 datasheet abstract
datasheet frame
Abstract: MT28F800B5 MT28F800B5_3.fm - Rev. 3, Pub. 8/2002 18Micron Technology, Inc. Reserves the right to change products or ... Original
datasheet

30 pages,
330.37 Kb

MT28F800B5 MT28F008B5 ESS Technology 8/512K MT28F800B5 abstract
datasheet frame
Abstract: LSI products. Both SG3 and SG5 have become our future process standards. Bipolar is an 18-micron ... Original
datasheet

23 pages,
130.58 Kb

9413 9347 9433 W 752 DG201ACJ DG211CJ DG212CJ DG411DY DG508ACJ DG509ACJ ICL7135 icl8069 equivalent IEC801-2 max132 application MAX691 MAX692 datasheet abstract
datasheet frame
Abstract: process standards. Bipolar is an 18-micron, 44V or 12-micron, 24V bipolar process, used chiefly for ... Original
datasheet

23 pages,
144.9 Kb

DG201ACJ DG211CJ DG212CJ DG302 to220 DG508ACJ DG509ACJ f 9444 icl7652 ICM7218AIPI IEC1000-4-2 MAX232 application notes MAX232CPE application sheet max809 zener 9514 datasheet abstract
datasheet frame
Abstract: nP3400 24 FE + 2 GE Integrated Network Processor (NPU, TM, Switching, MACs) Documents & Related Products Documents* There are no related documents at this time. * Additional related documentation is available to approved registered users. You may General Description The nP3400 Integrated Network Processor combines a network processor, switch fabric, and on-chip Fast Ethernet and Gigabit Ethernet Media Access Controller (MAC) to implement the complete core functionality of a highperforma ... Original
datasheet

1 pages,
90.39 Kb

nP3400 datasheet abstract
datasheet frame
Abstract: nP3404 2 GE + 2 GE Integrated NPU + Switch Fabric Documents & Related Products Documents* There are no related documents at this time. * Additional related documentation is available General Description The nP3404 Integrated Network Processor combines a network processor, switch fabric, and on-chip Fast Ethernet and Gigabit Ethernet Media Access Controller (MAC) to implement the complete core functionality of a highperformance packet switch for both line-card and standalone applications ... Original
datasheet

1 pages,
90.17 Kb

datasheet abstract
datasheet frame
Abstract: Product Change Notification 103341 ­ 01 Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel® products including liability or warranties rel ... Original
datasheet

3 pages,
111.75 Kb

RK80531RC033128 BX80531P180G128 datasheet abstract
datasheet frame
Abstract: Product Change Notification 103267 - 00 Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel® products including liability or warranties rel ... Original
datasheet

3 pages,
111.97 Kb

RK80531RC029128 pentium 4 BX80531P170G128 BX80532PC L68c datasheet abstract
datasheet frame
Abstract: 10 r · 12.96 ± 0.05 H 0 1 .3 5 ± 0.05 NOTES: 1. M ATERIAL: HOUSING: THERMAL PLASTIC. COLOR: SEE CHART $ e , è- G LASS FILLED: U L 9 4 V -0 TERM INAL/PEG: BRASS 2. TERMINAL PLATING: CONTACT A R E A : GOLD F LA S H SOLDER TAIL: TIN P LA T E D 1.27 MICRON MINIMUM OVER RECOMMENDED P.C.B LAYOUT CONNECTOR SIDE jRECO M M ANDED P.C. B O A R D T H IC K N E S S : 1.6 0 ± 0 .0 5 m m 1.27 MICRON MINIMUM NICKEL UNDER P L A T E 3. PEG PLATING: .J TIN P LA T E D 1.8 MICRON MINI ... OCR Scan
datasheet

2 pages,
115.16 Kb

datasheet abstract
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Abstract: LDV5000 LDV5000 Polaris Channel for DVC Platform The LDV5000 LDV5000 Polaris Channel is tailored to run on the 41.85MHz Digital Video Camera (DVC) platform. The main function is to read the signal from the media (presented by the preamp), extracting the data and the data clock for the controller. The secondary function is to detect the Automatic Tracking Frequencies of 465KHz and 697.5KHz. In the DVC system, the Polaris interfaces to the Preamp, MicroProcessor and Controller. Channel performance information ... Original
datasheet

2 pages,
60.97 Kb

30-300mVppd LDV5000 LDV5000 abstract
datasheet frame
Abstract: 10 8.4 4.25 ±0.05 5.40 ±0.08 - 12.96 3.60 max 7.60 min. - 16.9 - 6.45 y 4.05 B _L - 10.86 - 0.80 ±0.08 -1.65 ±0.15 - -A HWWOTh Cl D -1.84 ±0.15 1.79 ±0.15 2.65 ±0.08 - 2.20 ±0.08 SECTION D-D 0 45° IL EH 0.35 ±0.05 -i 1.25 ±0.05 -i \x: !X r~ 1.55 - 1.95 ±0.08 \ \ \ VnI 0.50 ±0.10 I- 0.85 - 0.3 ±0.05 3.95 0.50 ±0.10 J 1 30°" 4.75 ±0.15 SECTION A-A XX 4.25 ±0.15 SECTION C-C 0.95 - 6.20 2 4.95 - 6.40 0.70 ±0.13 SECTION B-B CQxf çsg c-»g c-vi evi 5s I- O CN Z fy(N ZZUJ 5T Lll< I Ll- . m -I - ... OCR Scan
datasheet

2 pages,
172.2 Kb

datasheet abstract
datasheet frame
Abstract: 10 M YLAR SCHEMATIC DRAWING OF M YLAR ONLY FOR 6 7 8 0 0 8 2 0 5 (SCALE 5:1) 6 7800- 82A 5 NOTES: 1. M ATER IA L: HOUSING/COLOR: S E E T A B LE , G LA S S FILLED , UL9AVTERM IN AL/R EG : BR A SS 2. TER M IN AL PLATING: CONTACT A R E A : () GOLD F L A S H (b) GOLD, THICKNES ).76 NICRON MINIMUM (C) GOLD,THICKNESS =0.38 MICRON MINIMUM SOLDER TAIL: TIN P L A T E D 1.27 MICRON MINIMUM OVER NICKEL P L A T E D 1.27 MICRON MINIMUM 3. PEG PLATING: TIN P L A T E D 1.27 MICRON MINIMUM OVER NICKEL ... OCR Scan
datasheet

2 pages,
178.89 Kb

PK-67800-001 PS-67491-001 67800-80A1 PK-67800-001 abstract
datasheet frame
Abstract: 10 r- 1 2 .8 3 * 0.05 CIRCUIT 1 0 1.3 5 * 0.05 67800-7055 RE CO MME ND ED P.C.B L A Y O U T 67800-7052 678 00-7051 SEE SEE SEE SEE SEE SEE SEE SEE SEE SEE SEE SEE SEE SEE SEE SEE SEE SEE SEE SEE SEE SEE SEE N0TE2(c) N0TE2(b) N O T E 2 (d ) NO TE2(c) N0TE2(b) N0TE2(b) NO TE 2(c > N O T E 2 (b ) N0TE2(q) N0TE2(c) N0TE2(a) NO TE2(c) N O T E 2 (b ) N0TE2(a) N0TE2(c) N0TE2(a) N0TE2(c) N O T E 2 (b ) N0TE2(a) N0TE2(c) N0TE2(a) NO TE2(c) N0TE2(b) TYPE DIM A DIM B P.C.B T H IC K N E ... OCR Scan
datasheet

2 pages,
164.43 Kb

datasheet abstract
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Over 1.1 million files (1986-2014): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer.
 
Accelerating Stockholder Value Completed manufacturing restructure Achieved .18-micron technology milestone Integrated QSI portfolio Increased content of value-added and higher margin products Leadership transition Increased revenues; reduced costs Increased investment and focus on high-growth communications market; exited x86 business Generated record revenue from
www.datasheetarchive.com/files/idt/docs/wcd00017/wcd017e5.htm
IDT 06/01/2000 1.89 Kb HTM wcd017e5.htm
.18-micron process technology in its Hillsboro, Oregon fabrication plant. The company
www.datasheetarchive.com/files/idt/docs/rp00000/rp00026.htm
IDT 06/10/2000 46.17 Kb HTM rp00026.htm
is a technology innovator with leading-edge .18-micron process technology in its
www.datasheetarchive.com/files/idt/docs/rp00000/rp0006f.htm
IDT 27/06/2001 41.68 Kb HTM rp0006f.htm
is a technology innovator with leading-edge .18-micron process technology in its
www.datasheetarchive.com/files/idt/docs/rp00000/rp00074.htm
IDT 19/05/2002 40.01 Kb HTM rp00074.htm
begin at .35-micron with the ability to migrate to .25- and .18-micron geometries. "Expanding this
www.datasheetarchive.com/files/national/docs/wcd00030/wcd0302f.htm
National 03/04/1998 4.56 Kb HTM wcd0302f.htm
success of the 0.15-micron capability, which correlates to the .18-micron process as defined by the SIA
www.datasheetarchive.com/files/texas-instruments/data/wwwti~1.com/sc/docs/news/1999/99018.htm
Texas Instruments 17/01/2000 11.58 Kb HTM 99018.htm
success of the 0.15-micron capability, which correlates to the .18-micron process as defined by the SIA
www.datasheetarchive.com/files/texas-instruments/data/www.ti.com/sc/docs/news/1999/99018.htm
Texas Instruments 18/01/2000 11.58 Kb HTM 99018.htm
leveraging our DSP-based multi-line architecture along with TI advanced .15-micron L-effective (.18-micron
www.datasheetarchive.com/files/texas-instruments/data/wwwti~1.com/sc/docs/news/1999/99034.htm
Texas Instruments 17/01/2000 14.5 Kb HTM 99034.htm
leveraging our DSP-based multi-line architecture along with TI advanced .15-micron L-effective (.18-micron
www.datasheetarchive.com/files/texas-instruments/data/www.ti.com/sc/docs/news/1999/99034.htm
Texas Instruments 18/01/2000 14.5 Kb HTM 99034.htm
No abstract text available
www.datasheetarchive.com/download/9152770-142556ZC/wcd01625.ppt
IDT 27/12/1999 1084.5 Kb PPT wcd01625.ppt