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Part Manufacturer Description Datasheet BUY
LTM9009CY-14#PBF-ES Linear Technology LTM9009-14 - 14-Bit, 80Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial visit Linear Technology - Now Part of Analog Devices
LTM9010CY-14#PBF-ES Linear Technology LTM9010-14 - 14-Bit, 105Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial visit Linear Technology - Now Part of Analog Devices
LTM9011IY-14#PBF-ES Linear Technology LTM9011-14 - 14-Bit, 125Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial visit Linear Technology - Now Part of Analog Devices
LTM9010IY-14#PBF-ES Linear Technology LTM9010-14 - 14-Bit, 105Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial visit Linear Technology - Now Part of Analog Devices
LTM9009IY-14#PBF-ES Linear Technology LTM9009-14 - 14-Bit, 80Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial visit Linear Technology - Now Part of Analog Devices
LTM9011CY-14#PBF-ES Linear Technology LTM9011-14 - 14-Bit, 125Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial visit Linear Technology - Now Part of Analog Devices

17X17* BGA 289

Catalog Datasheet MFG & Type PDF Document Tags

SG-BGA-6046

Abstract: SG-MLF-7004 196 14x14 196 22x22 228 16x16 256 16x16 256 16x16 256 16x16 256 26x26 276 17x17 289 17x17 289 18x18 324 20x20 400 26x26 420 26x26 420 22x22 484 22x22 484 22x22 484 24x24 , Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent , BGA High Density Sockets . . . . . . . . . . . . . . . . . . . . . . . . . page SG.5 Ghz MLF High Density Sockets . . . . . . . . . . . . . . . . . . . . . . . . . page SG.6 SMT Adapters for GHz BGA
Ironwood Electronics
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Abstract: BGA Socketing and Test Products Features_ â  Capable of monitoring signals while Ball Grid Array (BGA) package is operational â  Customized to match specific BGA footprints â  Accommodates up to 26x26 BGA arrays â  Performs with minimum delays and parasitics â  Multiple ground planes to maximize shielding and minimize interference â  Fans out BGA signals to 0.050" center header arrays â  Extension adapters available BG A BGA n t e r f a c e A d a p te r E x -
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BGA665

Abstract: BGA676 Ironwood Electronics Appendix A AP-A.1 APPENDIX A · BGA Chip Package Specification Tables , AP.18 · BGA Package Code Patterns . . . . . . . . . . . . . . . .page AP.19 thru AP.30 · LGA , .1 www.ironwoodelectronics.com Catalog XVII Ironwood Electronics AP-A.2 Appendix A BGA CHIP PACKAGE SPECIFICATIONS , Ironwood Electronics AP-A.3 Appendix A BGA CHIP PACKAGE SPECIFICATIONS Ironwood Package Code , 11X11 17X17 8X8 8X8 8X8 8X8 8X8 8X8 8X9 8X9 8X9 8X9 8X9 11X11 9X9 12X14 11X11 13X13
Ironwood Electronics
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BGA665 BGA676 BGA-1156 156 QFN 12X12 BGA-783 BGA441 BGA16A1 BGA20A1 BGA24A1 BGA28A1 BGA28B1 BGA32A1

17X17* BGA 289

Abstract: BGA289 (min.). Description: Giga-snaP BGA SMT Land Socket 289 position BGA surface mount land pattern to terminal pins (0.8mm centers, 17x17 array) Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm
Ironwood Electronics
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LS-BGA289D-61 17X17* BGA 289 BGA289 FR4/G10

17X17* BGA 289

Abstract: LS-BGA289A-31 (min.). Description: Giga-snaP BGA SMT Land Socket 289 position BGA surface mount land pattern to terminal pins (1.27mm [0.050"] centers, 17x17 array) Tolerances: diameters ±0.03mm [±0.001"], PCB
Ironwood Electronics
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LS-BGA289A-31

sony IMX 161

Abstract: STMP3780 x6 PWM* x8 x8 x8 x8 S/PDIF Tx - - Y Y Package 14x14 0.8mm 289 BGA 14x14 0.8mm 289 BGA 14x14 0.8mm 289 BGA 14x14 0.8mm 289 BGA * Represents maximum available â , various feature sets Battery Charger Audio S/PDIF Tx 289 BGA 14x14mm 0.8mm pitch -40C to +85C , 13x13 0.5mm 17x17 0.8 mm Features and Advantages â' High Performance CPU : Cortex-A8 â , /GP Core Voltage: 0.85V-1.3V Package: 19x19 0.8mm 529 ball BGA 12x12 0.4mm PoP (Consumer) Case
Freescale Semiconductor
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sony IMX 161 STMP3780 toshiba 16GB Nand flash emmc Cortex-A8 MIPI Sony IMX283 Toshiba emmc
Abstract: ] 14 , 5 0 [ . 5 7 1] 16 4 0 2 4 0 - 2 289 17X17 24.50 [ .964] 18 , 50 [.728] 16 , 3-1640240-7 289 17X17 25,50 [ 1.004] 19 , 50 [.768] 16 , 0 0 [.630] 38, 10 [ 1.500 , MATRIX BGA SOCKET TYPE 1 (1 MM) NO. OF CONTACTS GRID DIM 16 4 0 2 4 0 - 1 256 , I C A T I O N P/ N 1 6 4 0 9 0 5 ( BGA ) . 1- 1 6 4 0 2 4 0 - 5 900 30X30 37,50 [ 1 , TYPE 1 BGA PACKAGE SPEC SCALE = I0X CUSTOMER SPECIFICATIONS ARE SUBJECT DRAWING TO -
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16X16 19X19 20X20 22X22

APPLE AUTHENTICATION COPROCESSOR 2.0C

Abstract: AR6102 , SSP, SDIO, SPI, I2C, I2S) Family of products supporting various feature sets 289 BGA 14x14mm .8mm , , TV-Out, DDR1, Small package (BGA and QFP) Power Management, 1588 Dual Ethernet & L2 Switch, DDR2 , MCIMX257CJM4: $7.37 MCIMX258CJM4: $8.11 Package / Qual. 17x17 0.8 MAPBGA AECQ100-G3 17x17 0.8 MAPBGA AECQ100-G3 17x17 0.8 MAPBGA 17x17 0.8 MAPBGA 17x17 0.8 MAPBGA Freescale, the , 128LQFP 14x14mm -10 to +70C (Consumer) -40C to +85C (Industrial) 128 LQFP 169 BGA UART 2 2 3
Freescale Semiconductor
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APPLE AUTHENTICATION COPROCESSOR 2.0C AR6102 AUTHENTICATION COPROCESSOR 2.0C emmc roadmap emmc i.MX53 CON-F0960 MX27- MX25- MX35- MX233

PA-SO42-S-01

Abstract: PA-PGA181-02W prototyping adapter designs, supporting CSP, BGA, QFP, SOIC, PGA, PLCC, QIP, and DIP packages for most , .6 DUT (Device Under Test) PGA . . . . page PA.7 BGA with Surface Mount Lands . . . . page PA.8 BGA , Adapters PA.2 · BGA with Surface Mount Lands These adapters provide surface mount lands for attaching the BGA device. They employ high temperature FR4/G10 substrate which allows package soldering , in mechanical and electrical connections. · BGA with ZIF Sockets These adapters provide ZIF
Ironwood Electronics
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PA-SO42-S-01 PA-PGA181-02W actel 14100 BGA169C PA-PGA68-01 PA-PLCC84-02 PA-ZIP36-01W 12X12

1.27mm pitch zif socket 3M 21X21

Abstract: 1155 lga socket pins array of high quality sockets and receptacles for BGA, MGA, PGA, QIP, and QFP packages. We also offer , . . . . . . . . . . . . . . . page SK.3 BGA chip carriers (SMT land sockets) Male . . . page SK.5 BGA chip carriers (SMT land sockets) Female . page SK.10 QFP chip carriers (SMT land sockets) . . . . . . . page SK.15 BGA Testing and Probing . . . . . . . . . . . . . . . .page SK.16 0.1" pitch PGA , .28 Sockets and Receptacles Product Overview · BGA and QFP Chip Carriers (SMT Land Sockets) Our BGA and QFP
Ironwood Electronics
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1.27mm pitch zif socket 3M 21X21 1155 lga socket pins PGA zif socket 289 1155 lga socket amp bga 25x25 TEXTOOL 15x15 pga MGA10/100A-

ALP 102 B4

Abstract: an35 cu hen ma 484 208-Pin PQFP 0.50 936 240-Pin PQFP RQFP 0.50 1,197 256-Pin FineLine BGA 1.0 289 17x17 , 102 102 102 Notes (1), (2), (3) 484-Pin 599-Pin PGA FineLine BGA 220 220 220 274 274 254 254 208-Pin PQFP 147 147 147 147 147 240-Pin PQFP RQFP 256-Pin 356-Pin BGA FineLine BGA 176 600-Pin BGA 672-Pin FineLine BGA 220 (4) 254 (4) 254 (4) 338 (4) EPF10K30E EPF10K50E EPF10K50S , ball-grid arra y (BGA) packages. Devices in the sam e package are pin-com patible, alth o u g h som e
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ALP 102 B4 an35 cu hen ma 256-P 484-P 672-P EPF10K100B EPF10K100E EPF10K130E
Abstract: Components Small Package: BGA 13x13mm The TX517 is a complete transmitter solution with low-voltage , . The TX517 also incorporates a CW output stage. The TX517 is available in a BGA package that is , PACKAGE TYPE PACKAGE MARKING TRANSPORT MEDIA, QUANTITY ECO STATUS (2) TX517IZCQ BGA , soldered, suitable for use in specified lead-free soldering processes. DEVICE INFORMATION BGA-144 PINS , of the device. THERMAL INFORMATION THERMAL METRIC (1) TX517 BGA (144) (ZCQ) PINS JA Texas Instruments
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SLOS725A 100MSPS
Abstract: possible states to every other possible state. Therefore, 17X17 = 289 unique transitions. Test levels: (A , Components Small Package: BGA 13x13mm The TX517 is a complete transmitter solution with low-voltage , . The TX517 also incorporates a CW output stage. The TX517 is available in a BGA package that is , PACKAGE TYPE PACKAGE MARKING TRANSPORT MEDIA, QUANTITY ECO STATUS (2) TX517IZCQ BGA , soldered, suitable for use in specified lead-free soldering processes. DEVICE INFORMATION BGA-144 PINS Texas Instruments
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ISO/TS16949

VAA23

Abstract: ultrasound transducer circuit driver 1mhz state. Therefore, 17X17 = 289 unique transitions. Test levels: (A) 100% tested at 25°C. Over temperature , Stages ­ CW output TX Output Update Rate ­ Up to 100MSPS Minimal External Components Small Package: BGA , CW output stage. The TX517 is available in a BGA package that is Lead-Free (RoHS compliant) and Green , ) PACKAGED DEVICES TX517IZCQ (1) (2) PACKAGE TYPE BGA-144 PACKAGE MARKING TX517 TRANSPORT MEDIA, QUANTITY , lead-free soldering processes. DEVICE INFORMATION BGA-144 PINS TOP VIEW 1 A HV2B 2 GND 3 HV1B
Texas Instruments
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VAA23 ultrasound transducer circuit driver 1mhz nFBGA

611V

Abstract: ultrasound TRANSFORMER possible state. Therefore, 17X17 = 289 unique transitions. Test levels: (A) 100% tested at 25°C. Over , Rate ­ Up to 100MSPS Minimal External Components Small Package: BGA 13x13mm DESCRIPTION The TX517 , available in a BGA package that is Lead-Free (RoHS compliant) and Green. It is specified for operation from , ) PACKAGED DEVICES TX517IZCQ (1) (2) PACKAGE TYPE BGA-144 PACKAGE MARKING TX517 TRANSPORT MEDIA, QUANTITY , lead-free soldering processes. DEVICE INFORMATION BGA-144 PINS TOP VIEW 1 A HV2B 2 GND 3 HV1B
Texas Instruments
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611V ultrasound TRANSFORMER ultrasound transducer transformer 1mhz ultrasound transducer circuit driver SLOS725

on digital code lock using vhdl mini pr

Abstract: XC2V3000-BG728 .289 Configuration Details .289 Readback , .304 FG256 Fine-Pitch BGA Package , .313 CS144 Chip-Scale BGA Composite Pinout Diagram .314 FG256 Fine-Pitch BGA Composite Pinout Diagram
Xilinx
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on digital code lock using vhdl mini pr XC2V3000-BG728 TRANSISTOR 841 ternary content addressable memory VHDL XC2V6000-ff1152 verilog code for discrete linear convolution XC2064 XC3090 XC4005 XC5210 XC-DS501

RAM16X8

Abstract: verilog/verilog code for lvds driver ) . 289 Introduction .289 Xilinx DCI .289 Software Support , .402 FG256 Fine-Pitch BGA Package , . 411 CS144 Chip-Scale BGA Composite Pinout Diagram
Xilinx
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RAM16X8 verilog/verilog code for lvds driver 37101 verilog hdl code for triple modular redundancy xc2v3000fg marking code NJ SMD Transistor

XC4VLX25-10FF668C

Abstract: transistor equivalent table chart ba26 ne ßGA 1.0 289 17x17 356Pin ßGA 1.27 1,225 35x35 484-Pin Fi ne Li ne ßGA 1.0 529 23 x 2 3 , ball-grid array (BGA) packages. Devices in the same package are pin-compatible, although some devices have , common pins. This option will be supported with a 484-pin FineLine BGA package. By using SameFrame pin migration, all FineLine BGA packages are pin-compatible. For example, aboard can be designed to support 256-pin, 484-pin, and 672-pin FineLine BGA packages. The Quartus and MAX+PLUS II software automatically avoids
Xilinx
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XC4VLX25-10FF668C transistor equivalent table chart ba26 Virtex-4 viterbi XC4VSX55 M39AB39 DS112 UG075

T flip flop CMOS IC

Abstract: blf 188 285 285 285 286 286 287 289 291 292 297 297 298 299 300 UG002 (v2.2) 5 November 2007 , . FG256 Fine-Pitch BGA Package , . CS144 Chip-Scale BGA Composite Pinout Diagram (XC2V250) . FG256 Fine-Pitch BGA Composite Pinout Diagram (XC2V1000) . FG456 Fine-Pitch BGA Composite Pinout Diagram (XC2V1000) . FG676 Fine-Pitch BGA Composite Pinout
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T flip flop CMOS IC blf 188 FLEX10KE EPF10K100 EPF10K130 EPF10K200E 0K200S EPF10K10A
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