165 datasheet and Application Note, Data Sheet, Circuit, PDF, Pinout

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165 Datasheet, Circuit, PDF, & Application Note Results

Datasheet Search Results			1 - 50 of about 65 for 165
	165	BI Technologies	Custom Hybrid Military Grade Microcircuit	41.57 Kb, 3 Pages.	Buy Now!

	165	Gilway Technical Lamp	Unbased lamp. 6.0V, 0.850A.	41.52 Kb, 1 Pages.	Buy Now!

	165-006-001V11X	Diamond SA	OPTICAL TERMINATION MODULE	395.7 Kb, 2 Pages.	Buy Now!

	165019	N/A	CRIMP TERM SPADE YELL M6	29.48 Kb, 1 Pages.	Buy Now!

	165049	N/A	CRIMP TERM PIN YELL	280.95 Kb, 4 Pages.	Buy Now!

	16-50HB	N/A	GLIMMLAMPE FREI DRAHTENDEN 1.8MA	95 Kb, 2 Pages.	Buy Now!

	16-50SB	N/A	GLIMMLAMPE FREI DRAHTENDEN 0.5MA	95 Kb, 2 Pages.	Buy Now!

	1651	Nihon Dempa Kogyo Co., Ltd.	CRYSTAL CLOCK OSCILLATOR	46.77 Kb, 1 Pages.	Buy Now!

	1651	Nihon Dempa Kogyo Co., Ltd.	Controlled Oscillator, Crystal Clock Oscillator	42.72 Kb, 1 Pages.	Buy Now!

	16-512-10	Aries Electronics, Inc.	Eject-A-DIP Sockets	88.66 Kb, 1 Pages.	Buy Now!

	16-512-11	Aries Electronics, Inc.	Eject-A-DIP Sockets	88.66 Kb, 1 Pages.	Buy Now!

	1652	Nihon Dempa Kogyo Co., Ltd.	CRYSTAL CLOCK OSCILLATOR	46.77 Kb, 1 Pages.	Buy Now!

	1652	Nihon Dempa Kogyo Co., Ltd.	Controlled Oscillator, Crystal Clock Oscillator	42.72 Kb, 1 Pages.	Buy Now!

	165-200005-01	Thomas & Betts	Sockets for PLCC / SOJ Packages	551.64 Kb, 10 Pages.	Buy Now!

	165-200005-02	Thomas & Betts	Sockets for PLCC / SOJ Packages	551.64 Kb, 10 Pages.	Buy Now!

	165-200005-03	Thomas & Betts	Sockets for PLCC / SOJ Packages	551.64 Kb, 10 Pages.	Buy Now!

	165-200005-04	Thomas & Betts	Sockets for PLCC / SOJ Packages	551.64 Kb, 10 Pages.	Buy Now!

	165-200005-05	Thomas & Betts	Sockets for PLCC / SOJ Packages	551.64 Kb, 10 Pages.	Buy Now!

	165-200005-06	Thomas & Betts	Sockets for PLCC / SOJ Packages	551.64 Kb, 10 Pages.	Buy Now!

	165-200005-07	Thomas & Betts	Sockets for PLCC / SOJ Packages	551.64 Kb, 10 Pages.	Buy Now!

	165-200005-08	Thomas & Betts	Sockets for PLCC / SOJ Packages	551.64 Kb, 10 Pages.	Buy Now!

	165-200005-09	Thomas & Betts	Sockets for PLCC / SOJ Packages	551.64 Kb, 10 Pages.	Buy Now!

	165-200005-11	Thomas & Betts	Sockets for PLCC / SOJ Packages	551.64 Kb, 10 Pages.	Buy Now!

	165-200005-12	Thomas & Betts	Sockets for PLCC / SOJ Packages	551.64 Kb, 10 Pages.	Buy Now!

	165-200005-13	Thomas & Betts	Sockets for PLCC / SOJ Packages	551.64 Kb, 10 Pages.	Buy Now!

	165-200005-14	Thomas & Betts	Sockets for PLCC / SOJ Packages	551.64 Kb, 10 Pages.	Buy Now!

	165-200005-15	Thomas & Betts	Sockets for PLCC / SOJ Packages	551.64 Kb, 10 Pages.	Buy Now!

	165-200005-16	Thomas & Betts	Sockets for PLCC / SOJ Packages	551.64 Kb, 10 Pages.	Buy Now!

	165-200005-17	Thomas & Betts	Sockets for PLCC / SOJ Packages	551.64 Kb, 10 Pages.	Buy Now!

	165-200005-18	Thomas & Betts	Sockets for PLCC / SOJ Packages	551.64 Kb, 10 Pages.	Buy Now!

	165-200005-19	Thomas & Betts	Sockets for PLCC / SOJ Packages	551.64 Kb, 10 Pages.	Buy Now!

	1652200100	Wickmann USA, Inc.	20A,58V DC,Solderable,Blade Fuse	34.42 Kb, 2 Pages.	Buy Now!

	1652300100	Wickmann USA, Inc.	30A,58V DC,Solderable,Blade Fuse	34.42 Kb, 2 Pages.	Buy Now!

	1652400100	Wickmann USA, Inc.	40A,58V DC,Solderable,Blade Fuse	34.42 Kb, 2 Pages.	Buy Now!

	1652500100	Wickmann USA, Inc.	50A,58V DC,Solderable,Blade Fuse	34.42 Kb, 2 Pages.	Buy Now!

	1652600100	Wickmann USA, Inc.	60A,58V DC,Solderable,Blade Fuse	34.42 Kb, 2 Pages.	Buy Now!

	1652700100	Wickmann USA, Inc.	70A,58V DC,Solderable,Blade Fuse	34.42 Kb, 2 Pages.	Buy Now!

	1653013	Steven Label Corp.	1653013	50.9 Kb, 1 Pages.	Buy Now!

	16-531-10	Aries Electronics, Inc.	Eject-A-DIP Sockets	88.66 Kb, 1 Pages.	Buy Now!

	16-531-11	Aries Electronics, Inc.	Eject-A-DIP Sockets	88.66 Kb, 1 Pages.	Buy Now!

	165-320-003V-X02	Diamond SA	SINGLE MODE IN LINE ATTENUATOR	407.81 Kb, 2 Pages.	Buy Now!

	16-532-10	Aries Electronics, Inc.	Eject-A-DIP Sockets	88.66 Kb, 1 Pages.	Buy Now!

	16-532-11	Aries Electronics, Inc.	Eject-A-DIP Sockets	88.66 Kb, 1 Pages.	Buy Now!

	16-533-10	Aries Electronics, Inc.	Eject-A-DIP Sockets	88.66 Kb, 1 Pages.	Buy Now!

	16-533-11	Aries Electronics, Inc.	Eject-A-DIP Sockets	88.66 Kb, 1 Pages.	Buy Now!

	1653470000	Weidmuller	Connector: Wire to Board Connector: HDR: 4: 5: SOL: THRU	50.03 Kb, 1 Pages.	Buy Now!

	1653480000	Weidmuller	Connector: Wire to Board Connector: HDR: 6: 5: SOL: THRU	50.03 Kb, 1 Pages.	Buy Now!

	1653490000	Weidmuller	Connector: Wire to Board Connector: HDR: 8: 5: SOL: THRU	50.03 Kb, 1 Pages.	Buy Now!

	1653500000	Weidmuller	Connector: Wire to Board Connector: HDR: 10: 5: SOL: THRU	50.03 Kb, 1 Pages.	Buy Now!

	1653510000	Weidmuller	Connector: Wire to Board Connector: HDR: 12: 5: SOL: THRU	50.03 Kb, 1 Pages.	Buy Now!

	Datasheets per page: 50 \| 250 \| 500

Contextual Datasheet Results		1 - 50 of about 10000+ for 165
	First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA PowerPAKR Stress HAST Pressure Abstract: .. HAST 165 16,500 130C, 85%RH 0 0.00. Pressure Pot 165 15,840 121, 15 PSIG 0 0.00. Temp Cycle 165 165,000 −65C−150C 0 0.00 .. datasheet abstract..	20.09 Kb	1 Pages

	First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA PowerPAKR Stress HAST Pressure Abstract: .. HAST 165 16,500 130 C, 85%RH 0 0.00. Pressure Pot 165 15,840 121 , 15 PSIG 0 0.00. Temp Cycle 165 165,000 −65 C−150 C 0 0.00 .. datasheet abstract..	19.92 Kb	1 Pages

	First line: mnPk 777t3q wu©p Size Square DIOTEC ELECTRONICS CORP PROPRIETARY SOFT GLASS JUNCTION Abstract: .. Die Size: 0.165" x 0.165" Square VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION Solder Voids: Typical < 2%, Max. < 10% of Die Area RoHS COMPLIANT .. datasheet abstract..	242 Kb	1 Pages

	First line: klEi bbbr3o Size Square DIOTEC ELECTRONICS CORP PROPRIETARY SOFT GLASS JUNCTION PASSIVATION Abstract: .. Die Size: 0.165" x 0.165" Square. VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION Solder Voids: Typical < 2%, Max. < 10% of Die Area RoHS COMPLIANT .. datasheet abstract..	243.84 Kb	1 Pages

	First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA PPAK SOIC8 Stress HAST Abstract: .. HAST 165 21,900 130 °C, 85 % RH 0 0.00. Pressure Pot 165 15,840 121°, 15 PSIG 0 0.00. Temp Cycle 165 109,250 - 65 °C to 150 °C 0 0.00. .. datasheet abstract..	29.54 Kb	1 Pages

	First line: Tape Reel SOT223 01-0028 01-0008 Abstract: .. T > 165 °c. I > Isd. 2 D. 1 2 3. In D S .. datasheet abstract..	26.88 Kb	1 Pages

	First line: Lead Assignments Abstract: .. T > 165°c. I > Isd. 2 D. 1 2 3. In D S .. datasheet abstract..	26.71 Kb	1 Pages

	First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA MINIQFN-6L Stress BOND HAST Abstract: .. 85/85 165 27,720 85 °C, 85 % RH 0 0.00. BOND INT 80 40,000 200 °C + N2 0 0.00. HAST 165 16,500 130 °C, 85 % RH 0 0.00. Pressure Pot 165 15,840 121°, 15 PSIG 0 0.00. Solder DUNK 55 165 260 °C, 10 SEC 0 0.00. Temp Cycle .. datasheet abstract..	30.21 Kb	1 Pages

	First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA MINIQFN-10L Stress BOND HAST Abstract: .. 85/85 165 27,720 85 °C, 85 % RH 0 0.00. BOND INT 120 60,000 200 °C + N2 0 0.00. HAST 165 16,500 130 °C, 85 % RH 0 0.00. Pressure Pot 165 15,840 121°, 15 PSIG 0 0.00. Solder DUNK 55 165 260 °C, 10 SEC 0 0.00. Temp Cycle .. datasheet abstract..	30.21 Kb	1 Pages

	First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA SC-70-5L POWER Stress BOND Abstract: .. Pressure Pot 165 15,840 121°, 15 PSIG 0 0.00. Temp Cycle 165 165,000 - 65 °C - 150 °C 0 0.00. .. datasheet abstract..	29.92 Kb	1 Pages

	First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA TSSOP14 STRESS HAST Pressure Abstract: .. HAST 165 16500 130 °C, 85 % RH 0 0.00. Pressure Pot 165 16500 121 °, 15 PSIG 0 0.00. Solderability 45 360 883 M2003 0 0.00. Temp Cycle 185 82900 - 65 °C to 150 °C 0 0.00. .. datasheet abstract..	20.44 Kb	1 Pages

	First line: Package Reliability Vishay Siliconix ENVIRONMENTAL TESTING DATA MICRO FOOT Pitch Stress HAST Abstract: .. HAST 165 16,500 130 °C, 85 % RH 0 0.00. Pressure Pot 165 15,640 121°, 15 PSIG 0 0.00. Temp Cycle 240 233,750 - 65 °C - 150 °C 0 0.00. .. datasheet abstract..	30.17 Kb	1 Pages

	First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA MINIQFN-16 Stress BOND HAST Abstract: .. 85/85 165 27,720 85 °C, 85 % RH 0 0.00. BOND INT 200 150,000 200 °C + N2 0 0.00. HAST 165 165,500 130 °C, 85 % RH 0 0.00. Pressure Pot 165 15,840 121°, 15 PSIG 0 0.00. Solder DUNK 55 165 260 °C, 10 SEC 0 0.00. Solderability .. datasheet abstract..	30.31 Kb	1 Pages

	First line: horizontal card guides Snap-in Card Guides Horizontally Mounting 1 / 16th PCBs Standard parts Abstract: .. entry ramps for PCB insertion ease • Fixed center line of 0.165" 4.2mm other centerlines available subject to minimum orders www.bivar.com 21 cage code FSCM 32559 © copyright 2004 Bivar .. datasheet abstract..	624.68 Kb	1 Pages

	First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA TSSOP 8-LEAD SOLDER PROCESS Abstract: .. HAST 165 16,500 130C, 85%RH 0 0.00. Pressure Pot 165 15,840 121, 15 PSIG 0 0.00. Temp Cycle 275 206,250 −65C−150C 0 0.00. Solder DUNK 285 855 260C 10SEC 0 0.00. Solderability 135 13,200 883 M2003 0 0.00 .. datasheet abstract..	18.8 Kb	1 Pages

	First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA TSSOP 8-LEAD SOLDER PROCESS Abstract: .. Temp Cycle 165 96,250 −65C−150C 0 0.00 .. datasheet abstract..	24.72 Kb	1 Pages

	First line: UNIT Applied Package 168-pin DIMM Quantity PCS Cover tray LH-6598 MAX. LH-6598 Abstract: .. 165. 255. 55. Applied Package Quantity PCS 168-pin DIMM. Cover tray. 1.25′′ 1.3′′ 1.375′′ 1.5 .. datasheet abstract..	13.45 Kb	1 Pages

	First line: STMicroelectronics TO-92 MECHANICAL DATA DIM. MIN. TYP. MAX. MIN. TYP. MAX. inch Abstract: .. C 3.2 4.2 0.126 0.165. D 12.7 0.500. E1.2 7 0.05 0. F 0.4 0.51 0.016 0.020. G0.3 5 0.1 4. TO-92 MECHANICAL .. datasheet abstract..	12.79 Kb	1 Pages

	First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA POWERPAK SC-70 Stress BOND Abstract: .. HAST 165 16,500 130 °C, 85 % RH 0 0.00. Pressure Pot 165 16,500 121°, 15 PSIG 0 0.00. Solderability 20 480 883 M2003 0 0.00. Temp Cycle 165 82,500 - 65 °C - 150 °C 0 0.00. .. datasheet abstract..	30.16 Kb	1 Pages

	First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA SC70JW-8L Stress BOND HAST Abstract: .. HAST 165 16,500 130°C, 85%RH 0 0.00. Pressure Pot 165 15,800 121°C, 15PSIG 0 0.00. Solder DUNK 54 540 260°C, 10SEC 0 0.00. Solderability 16 120 883 M2003 0 0.00. Temp Cycle 165 82,500 -65°C-150°C 0 0.00 .. datasheet abstract..	33 Kb	1 Pages

	First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA TO-263 P-J Stress BOND Abstract: .. HAST 165 100 hrs 130C, 85%RH 0 0.00. Pressure Pot 165 96 hrs, 168 hrs 121, 15 PSIG 0 0.00. Solder DUNK 45 260C, 10 SEC 0 0.00. Solderability 45 8 hrs 883 M2003 0 0.00. Temp Cycle 165. 250 cyc, 500 cyc, 1000 cyc .. datasheet abstract..	26.59 Kb	1 Pages

	First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA SOT-923 STRESS BOND HAST Abstract: .. Pressure Pot 165 15,840 121°, 15 PSIG 0 0.00. Solderability 60 1,440 883 M2003 0 0.00. Temp. Cycle 165 165,000 - 65 °C to 150 °C 0 0.00. .. datasheet abstract..	21.65 Kb	1 Pages

	First line: Amphenol Series Miniaturized Standard Connectors 12-023-6 Amphenol Table Contents Amphenol Series Minni Abstract: .. Amphenol 67 and 165 Series Miniaturized Standard Connectors 12-023-6. Amphenol. ®. Table of Contents Page No.. Amphenol® 67 Series “Minni E” General Information, Design Characteristics, Customer .. datasheet abstract..	4231.02 Kb	10 Pages

	First line: Abstract: .. DD171N06K-A 2 KM14 300 165 5. DD171N06K-K 2 KM14 300 165 5. ND171N06K 1 KM14 300 165 5. DD260N06K-A 2 KM14 300 200 5. DD260N06K-K 2 KM14 300 200 5. ND260N06K 1 KM14 300 200 5. ND89N12K 1 KM10 600 40 3. DD89N12K .. datasheet abstract..	3.71 Kb	1 Pages

	First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA PowerPAKr TSSOP-16 Stress HAST Abstract: .. Pressure Pot 165 15,840 121, 15 PSIG 0 0.00. Solderability 20 N/A 883 M2003 0 0.00. Temp Cycle 163 81,500 −65C−150C 0 0.00 .. datasheet abstract..	19.85 Kb	1 Pages

	First line: Transistors Switching 500V 2SK2793 FFeatures on-resistance. Fast switching speed. Wide safe operating Abstract: .. 165. Transistors 2SK2793. Switching characteristics measurement circuit .. datasheet abstract..	138.73 Kb	4 Pages

	First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA PowerPAKR SOLDER PROCESS Stress Abstract: .. Pressure Pot 165 19,800 121, 15 PSIG 0 0.00. Temp Cycle 220 220,000 −65C−150C 0 0.00 .. datasheet abstract..	25.86 Kb	1 Pages

	First line: Abstract: .. .067 1.7 .165 4.2 .275 7.0 MAX. .019 0.5 .09 2.3 .177 4.5 .09 2.3 .09 2.3 .008 0.2 .006 015 .027 0.7 .057 1.3 .035 0.9 .057 1.3 .150 3.8 B1S THRU B10S. .. datasheet abstract..	7.31 Kb	1 Pages

	First line: Abstract: .. .185 4.7 .165 4.2 .280 7.1 .260 6.6 .205 5.2 .185 4.7 .052 1.3 .260 6.8 .180 4.5 .455 11.3 .405 10.3 .085 2.2 .065 1.7 .160 4.1 .140 3.6 .760 19.3 MAX. .220 5.6 .180 .. datasheet abstract..	9.78 Kb	1 Pages

	First line: Philips Components Maintenance type Non-solid electrolytic capacitors Radial High Temperature FEATURES Polarized Abstract: .. RHT 165. FEATURES. • Polarized aluminium electrolytic capacitors, non-solid. • Radial leads, cylindrical aluminium case with pressure relief, insulated with a blue sleeve. • Charge and discharge .. datasheet abstract..	63.41 Kb	10 Pages

	First line: Philips Components Maintenance type Aluminium electrolytic capacitors Radial High Temperature FEATURES Polarized Abstract: .. 165 RHT. FEATURES. • Polarized aluminium electrolytic capacitors, non-solid. • Radial leads, cylindrical aluminium case with pressure relief, insulated with a blue sleeve. • Charge and discharge .. datasheet abstract..	50.47 Kb	10 Pages

	First line: Vishay BCcomponents Aluminum Capacitors Radial High Temperature FEATURES Polarized aluminum electrolytic capacitors Abstract: .. 165 RHT. Vishay BCcomponents. Document Number: 28368 For technical questions contact: aluminumcaps1@vishay.com. www.vishay.com. Revision: 16-Nov-05 1. Aluminum Capacitors Radial, High Temperature .. datasheet abstract..	102.95 Kb	7 Pages

	First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA POWERPAK SC-75 Stress BOND Abstract: .. HAST 165 13,750 130 °C, 85 % RH 0 0.00. Pressure Pot 110 10,560 121°, 15 PSIG 0 0.00. Solderability 15 360 883 M2003 0 0.00. Temp Cycle 165 82,500 - 65 °C - 150 °C 0 0.00. .. datasheet abstract..	30.19 Kb	1 Pages

	First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA QSOP-36 Stress BOND HAST Abstract: .. HAST 165 22,000 130C, 85%RH 0 0.00. Solder Dunk 55 550 260C, 10 SEC. 0 0.00. Pressure Pot 165 26,400 121, 15 PSIG 0 0.00. Solderability 16 320 883 M2003 0 0.00. Temp Cycle 415 268,785 −65C−150C 0 0.00 .. datasheet abstract..	19.43 Kb	1 Pages

	First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA SC-70-3 STRESS BOND HAST Abstract: .. Solder Dunk 165 495 260 °C, 10 s 0 0.00. Solderability 20 480 883 M2003 0 0.00. Temp. Cycle 165 137,500 - 65 °C to 150 °C 0 0.00. .. datasheet abstract..	21.17 Kb	1 Pages

	First line: PROCESS CPS165 Silicon Controlled Rectifier Sensitive Gate Chip PROCESS DETAILS Process Size Abstract: .. Die Size 165 x 165 MILS. Die Thickness 8.7 MILS. Cathode Bonding Pad Area 131 x 91 MILS. Gate Bonding Pad Area 31 x 31 MILS. Top Side Metalization Al - 45,000Å. Back Side Metalization Al/Mo/Ni/Ag - 32,000 .. datasheet abstract..	33.7 Kb	1 Pages

	First line: PROCESS CPQ165 TRIAC Volt TRIAC Chip PROCESS DETAILS Process Size Thickness Bonding Abstract: .. Die Size 165 x 165 MILS. Die Thickness 8.6 MILS ± 0.6 MILS. MT1 Bonding Pad Area 134 x 83 MILS. Gate Bonding Pad Area 35 x 35 MILS. Top Side Metalization Al - 45,000Å. Back Side Metalization Al/Mo/Ni/Ag - 32 .. datasheet abstract..	32.29 Kb	1 Pages

	First line: SMALL OUTLINE PACKAGE CERAMIC FPT-14C-A01 14-pin ceramic Lead pitch Lead shape Sealing Abstract: .. 4.20 .165 TYP. 10.00 .394 TYP. 1.27 .050 TYP. 0.40 .016 TYP. 5.00 .197 .236±.008 6.00±0 .. 165 4.60TYPx8.60TYP .181x.339 0.125 .005 TYP. 1.80 .071 MAX. 0.20TYP .008 .027 .. datasheet abstract..	19.02 Kb	1 Pages

	First line: Abstract: .. C 3.20 4.20 0.126 0.165. D 12.70 0.500. E 1.27 0.050. F 0.40 0.51 0.016 0.020. G 0.35 0.140. TO-92 .. datasheet abstract..	19 Kb	1 Pages

	First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA Cerquad Stress HAST Pressure Abstract: .. Solder DUNK 55 165 260C, 10SEC 0 0.00. Solderability 30 240 883 M2003 0 0.00. Temp Cycle 110 55,000 −65C−150C 0 0.00 .. datasheet abstract..	19.27 Kb	1 Pages

	First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA PLCC Stress HAST Pressure Abstract: .. Solderability 165 1,440 883 M2003 0 0.00. Temp Cycle 1,175 432,500 −65C−150C 0 0.00 .. datasheet abstract..	18.56 Kb	1 Pages

	First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA 1206-8 ChipFET Stress BOND Abstract: .. Pressure Pot 165 15,840 121, 15 PSIG 0 0.00. Solder DUNK 185 555 260C, 10SEC 0 0.00. Solderability 15 120 883 M2003 0 0.00. Temp Cycle 320 187,500 −65C−150C 0 0.00 .. datasheet abstract..	19.79 Kb	1 Pages

	First line: Package Outline TYP. 16-Lead Plastic Dual-In Line Package Note Circle e.g. indicates Abstract: .. 0.165 ∠ 0.005. 0.250 ∠ 0.005. 0.150 ∠ 0.015. A. L. 0.018 ∠ 0.003 B. 0.100 TYP. e1. 0.030 ∠ 0.005 Q. 0.750 ∠ 0 .. datasheet abstract..	10.13 Kb	1 Pages

	First line: Package Outline TYP. 14-Lead Ceramic Dual-In Line Package Note Circle e.g. indicates Abstract: .. 0.165 ∠ 0.005. 0.250 ∠ 0.008. 0.130 ∠ 0.015. A. L. 0.018 ∠ 0.002 B 0.100 TYP. e1. 0.035 ∠ 0.005 Q. 0.310 ∠ 0 .. datasheet abstract..	10.24 Kb	1 Pages

	First line: Package Outline TYP. 14-Lead Plastic Dual-In Line Package Note Circle e.g. indicates Abstract: .. 0.165 ∠ 0.005. 0.250 ∠ 0.008. 0.130 ∠ 0.015. A. L. 0.018 ∠ 0.002 B 0.100 TYP. e1. 0.035 ∠ 0.005 Q. 0.310 ∠ 0 .. datasheet abstract..	9.89 Kb	1 Pages

	First line: SIPAT Co.Ltd Specifications Parameter Center Frequency Insertion Loss Bandwidth Bandwidth Bandwidth Bandwidth Abstract: .. Center Frequency MHz 165.25 165.4 165.55. Insertion Loss dB - 26 27. 1 dB Bandwidth MHz 7.5 7.59 -. 3 dB Bandwidth MHz 8 8.15 -. 40 dB Bandwidth MHz - 9.99 10. 50 dB Bandwidth MHz - 10.18 -. Passband Variation .. datasheet abstract..	46.95 Kb	1 Pages

	First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA SC-75A Stress HAST Pressure Abstract: .. HAST 165 13,750 130C, 85%RH 0 0.00. Pressure Pot 365 35,040 121, 15 PSIG 0 0.00. Solder DUNK 40 240 260C, 10SEC 0 0.00. Solderability 45 360 883 M2003 0 0.00. Temp Cycle 365 185,000 -65C-150C 0 0.00 .. datasheet abstract..	22.28 Kb	1 Pages

	First line: Zener Voltage 3.3-100V Peak Pulse Power 1.0W Abstract: .. 0..205 5.2 0.165 4.2 1.10 27.9 MIN. Dimensions in inches and millimeters 1.10 27.9 MIN. •!! !!"#$• •%&’ & +,,---.&./0 •12&%#%3&./0• 2591 A. μ! ! "# "# ! $% &’ ! ! •!! !!"#$• •%&’ & +,,---.&./0 .. datasheet abstract..	417.06 Kb	3 Pages

	First line: WIRE BOARD CONNECTORS ADAM TECHNOLOGIES INTRODUCTION Adam Tech Series Power Connectors consist Abstract: .. a receptacle and plug set in a variety of single and multiple row configurations with 165” centerlines. They are manufactured of Nylon 6/6 with a flammability rating of UL94V-2 or UL94V-0. This .. datasheet abstract..	623.93 Kb	3 Pages

	First line: Shunts SHUNTS Voltage drop Material Manganin resistance rods copper bars Surface treatment Abstract: .. 900 6125 3 165 115 60 — 30 40 10 M20. 1000 6126 3 165 115 60 — 30 40 10 M20. 1200 6132 4 165 115 90 48 21 40 10 M16. 1500 6127 4 165 115 90 48 21 40 10 M16. 2000 6128 4 165 115 90 48 21 40 10 M16. 2500 6129 4 165 115 120 60 30 40 .. datasheet abstract..	99.04 Kb	2 Pages

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Specsheet Results
	1650-01	Industrial Electronic Engineers	Seven-Segment Numeric LCD Display - FE,Ref	Specification

	16503	N/A	Power, General Purpose	Specification

	16503	N/A	Silicon NPN	Specification

	1651C01A	North Atlantic Instruments Inc	14-Bit Synchro-Resolver-to-Digital Converter	Specification

	1651C01B	North Atlantic Instruments Inc	12-Bit Synchro-Resolver-to-Digital Converter	Specification

	1651C02A	North Atlantic Instruments Inc	14-Bit Synchro-Resolver-to-Digital Converter	Specification

	1651C02B	North Atlantic Instruments Inc	12-Bit Synchro-Resolver-to-Digital Converter	Specification

	1651C03A	North Atlantic Instruments Inc	14-Bit Synchro-Resolver-to-Digital Converter - 50/400Hz	Specification

	1651C03B	North Atlantic Instruments Inc	12-Bit Synchro-Resolver-to-Digital Converter - 50/400Hz	Specification

	1651C05A	North Atlantic Instruments Inc	14-Bit Synchro-Resolver-to-Digital Converter - 50/400Hz	Specification

	1651C05B	North Atlantic Instruments Inc	12-Bit Synchro-Resolver-to-Digital Converter - 50/400Hz	Specification

	1651C06A	North Atlantic Instruments Inc	14-Bit Synchro-Resolver-to-Digital Converter - 50/400Hz	Specification

	1651C06B	North Atlantic Instruments Inc	12-Bit Synchro-Resolver-to-Digital Converter - 50/400Hz	Specification

	1651C07A	North Atlantic Instruments Inc	14-Bit Synchro-Resolver-to-Digital Converter - 50/400Hz	Specification

	1651C07B	North Atlantic Instruments Inc	12-Bit Synchro-Resolver-to-Digital Converter - 50/400Hz	Specification

	1651C11A	North Atlantic Instruments Inc	14-Bit Synchro-Resolver-to-Digital Converter - 50/400Hz	Specification

	1651C11B	North Atlantic Instruments Inc	12-Bit Synchro-Resolver-to-Digital Converter - 50/400Hz	Specification

	1651M01A	North Atlantic Instruments Inc	14-Bit Synchro-Resolver-to-Digital Converter	Specification

	1651M01B	North Atlantic Instruments Inc	12-Bit Synchro-Resolver-to-Digital Converter	Specification

	1651M02A	North Atlantic Instruments Inc	14-Bit Synchro-Resolver-to-Digital Converter	Specification

Cross References
	165	Cross References (16)

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