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Part : MD-148-PIN Supplier : M/A-COM Manufacturer : Richardson RFPD Stock : - Best Price : - Price Each : -
Part : MDS-148-PIN Supplier : M/A-COM Manufacturer : Richardson RFPD Stock : 1 Best Price : $331.3600 Price Each : $331.3600
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148-pin

Catalog Datasheet MFG & Type PDF Document Tags

FBGA-12

Abstract: FBGA HEAT PROOF 7 12.2 10.55 16.40 A' 8×20=160 A 135°C MAX. NEC PPE 114.8 FBGA12×12×1.26 15.50 10.25 12.2 294.5 315.0 (322.6) SECTION A-A' 6.32 (6.35) 12.2 7.62 135.9 UNIT : mm Applied Package Quantity (pcs) 121-pin Plastic FBGA ( 12) MAX. 160 Material 148-pin Plastic FBGA ( 12) MAX. 160 Heat Proof Temp. Tray Surface resistance FBGA 12 × 12 × 1.26 Carbon PPE 135°C less than 1 × 1012 / The tolerance of tray
NEC
Original
FBGA-12 FBGA FBGA121

EP4CE6 eqfp

Abstract: 148-PIN Package 148-pin QFN 169-pin FBGA EP4CGX22 Number ×9 Groups Bottom (3) EP4CGX15 Number , devices in 148-pin QFP, 169-pin FBGA, and 324-pin FBGA. Cyclone IV Device Handbook, Volume 1 , of the DQS, DQ, or CQ# pins in I/O banks of the Cyclone IV GX device in the 148-pin QFP and 169 , GX Device 148-pin QFP and 169-pin FBGA Packages I/O Bank 3 © February 2010 I/O Bank 8 I , IV GX Devices in the 148-Pin QFP and 169-Pin FBGA Packages Cyclone IV Device Handbook, Volume 1
Altera
Original
EP4CE6 eqfp 148-PIN EP4CE115 EP4CGX30 EP4CE10 Memory Interfaces CYIV-51007-2

148-pin

Abstract: philips 334 (0.25) 0.008 (0.20) Philips Semiconductors Package outlines 148-PIN CERAMIC QUAD FLAT PACK (Y
Philips Semiconductors
Original
philips 334

fbga 12X12

Abstract: EA1 transistor 148-PIN PLASTIC FBGA (12x12) OUTLINE DRAWINGS w D S B ZD D1 B 13 12 11 10 9 8 7 6 5 4 3 2 1 ZE A E1 E NM L K J HG F E DC B A w INDEX MARK S A 4-C1.0 4-R0.3 A 25° y1 A2 S S y S e 148- b A1 x M S A B ITEM D MILLIMETERS 12.00±0.10 D1 11.4 E E1 12.00±0.10 11.4 w 0.20 e A 0.80 1.31±0.15 A1 A2 0.35±0.10 0.96 b 0.50+0.05 -0.10 x 0.08 y y1 ZD ZE 0.10 0.20 1.2
NEC
Original
fbga 12X12 EA1 transistor P148F1-80-EA1
Abstract: Commercial Temperature Range 0° to 70° Package: 12x12mm, 148-pin LFBGA, w/0.8mm ball pitch - Pb free and Pericom Semiconductor
Original
PI7C9X20404GP

S19225

Abstract: 148-pin output clock during loss-of-signal conditions q Postamp on serial input q 148-Pin CBGA package q
Applied Micro Circuits
Original
S3092 S19225 S19204 s19203 S19205 S3091 OC-192 OC-192/STM-64 148-P S-G16

h148

Abstract: SLA600L 80pin F80-5 A A A A A 100pin F100-5 A A A A Ceramic FP 148pin H148 A A A Plastic SOP
-
OCR Scan
SLA600L SLA6000 SLA605L SLA608L SLA614L SLA617L h148 SLA643L SLA662L A600L

VSC8248

Abstract: VSC8488 LD Rx Tx DC Power 148-pin CFP SoG MUX C F PCompliant Interface Logic Rx 4× 10G Tx 4 × 1 0
Vitesse Semiconductor
Original
VSC8248 VSC8488 VSC8484 10G CDR VSC7986 VSC3316 VSC7987 VPPD-02545

amcc S19203

Abstract: RX622 Power 1.3 W (typ) Compact 15 mm x 15 mm 148-pin CBGA package · · · · · · · · · SONET , ) . 12 Figure 4. Compact 15 mm x 15 mm 148-pin CBGA Package , mm 148-pin CBGA Package Table 7. Package Thermals Max Package Power (85°C Ambient) (Assuming
Applied Micro Circuits
Original
S3098 amcc S19203 RX622 amcc s3095 S3090 S3097 C-192 D38/R831

s19203

Abstract: s3098 internal FIFO to decouple transmit clocks Power 1.9 W (typ) Compact 15 mm x 15 mm 148-pin CBGA package , ) . 13 Figure 4. Compact 15 mm x 15 mm 148-pin CBGA Package , Transmitter DEVICE SPECIFICATION Figure 4. Compact 15 mm x 15 mm 148-pin CBGA Package Table 7
Applied Micro Circuits
Original
amcc CDR Forward Path Laser Transmitter Module Diagram germanium power devices corporation S19202 S19202CBI20 D37/R830

AMCC STS-192

Abstract: s3091 clock mode 148-pin CBGA package Typical power dissipation 2.3 W DEVICE SPECIFICATION APPLICATIONS , . 12 Figure 6. S3091 148-Pin CBGA Package , ) (Die BOTTOM View) 12 S3091 ­ SONET/SDH/ATM OC-192 16:1 Transmitter Figure 6. S3091 148-Pin CBGA
Applied Micro Circuits
Original
AMCC STS-192 h13 d526 D526/R858

D526

Abstract: S3091 mode 148-pin CBGA package Typical power dissipation 2.3 W · · · · · · · · · SONET , . 12 Figure 6. S3091 148-Pin CBGA Package , DEVICE SPECIFICATION Figure 6. S3091 148-Pin CBGA Package Table 9. Thermal Management Device
Applied Micro Circuits
Original
D526 transistor D526 transistor D526 DATA SHEET STM-16 STM-64 STS-192 D526/R971

Xlaui

Abstract: SUMITOMO FLAT CABLE Application à 148pin Electrical Connector Inter Rack Connection à à Easy supply , package. The SCF0400L4 contains a duplex SC or LC connector for the optical interface and a 148-pin , . TX0 p/n OT0 TX1 p/n OT1 CDR LDD TOSA OT2 148PIN CONNECTOR TX3 p/n OT3
Sumitomo Electric
Original
Xlaui SUMITOMO FLAT CABLE TS-S10D032B 40GBASE-LR4 IEEE802 3125GB 40GBASELR4 40GBASE-R

LEAPER-3

Abstract: 74189 Factor à 148pin Electrical Connector Point to Point and Ring Application à à Easy , Conversion TX_MCLK 148PIN CONNECTOR RX0 p/n RX1 p/n RX2 p/n RX3 p/n OR0 RX_MCLK MDIO/MDC
Leap Electronic
Original
LEAPER-3 74189 7489 sram 89C51 interfacing with lcd display 4N34 ic 74192 pin configuration SU-2000 PIC16C52/54/54A PIC16C55/56/57/57A/58A PIC12C508/509 PIC16C61 PIC16C620/621/622

EP4CE15

Abstract: EP4CE6 eqfp Applications CFP MSA Compliant   CFP MSA Form Factor  148pin Electrical Connector ï , connector for the optical interface and a 148-pin connector for the electrical interface. Figure 2.1 shows
Altera
Original
EP4CE15 DIODE CQ 618 ep4cgx110 EP4CE40 EP4CE75 ttl to mini-lvds CYIV-51006-2

Optical Network Unit

Abstract: Resolution Static Timing Analysis · High-Performance Packaging Options: - 319 and 148-Pin Ceramic Pin Grid , , HVM10000, HE12000 HONEYWELL/SS ELEK, M I L 1.400 148-PIN GRID ARRAY THERMAL CHARACTERISTICS -.0 9
Sumitomo Electric
Original
Optical Network Unit TS-S11D090B SCF0420FR NGG01 40GBASE-FR VSR2000-3R2 STM-256/OC-768

PM 8038

Abstract: e/10Gb CDR à CFP MSA Form Factor Inter Rack Connection à 148pin Electrical Connector Other , SCF1001L4 contains a duplex SC or LC connector for the optical interface and a 148-pin connector for the , TOSA TX9 p/n OT2 Optical MUX OT3 TX_MCLK 148PIN CONNECTOR RX0 p/n OR0 RX9 p/n
Sumitomo Electric
Original
PM 8038 e/10Gb CDR TS-S10D166C SCF0400E4 40GBASE-ER4 40GE-ER4 95328G 3125G

HM3500

Abstract: L42n Resolution Static Timing Analysis · High Performance Packaging Options: - 148-Pin Ceramic Pin-Grid-Array -
-
OCR Scan
HM3500 L42n L44N PT06-16-8P-S/transistor 03e ECL IC NAND DD00212 ECL10K/KH/100K MIL-STD-883C MIL-M-38510/600

SCF1001L4

Abstract: 8029 l2 Package 148-pin QFN 169-pin FBGA EP4CGX22 Number ×9 Groups Bottom (3) EP4CGX15 Number , devices in 148-pin QFP, 169-pin FBGA, and 324-pin FBGA. Cyclone IV Device Handbook, Volume 1 , of the DQS, DQ, or CQ# pins in I/O banks of the Cyclone IV GX device in the 148-pin QFP and 169 , GX Device 148-pin QFP and 169-pin FBGA Packages I/O Bank 3 © February 2010 I/O Bank 8 I , IV GX Devices in the 148-Pin QFP and 169-Pin FBGA Packages Cyclone IV Device Handbook, Volume 1
Sumitomo Electric
Original
8029 l2 SCF1011L4LNGG01 TS-S12D072D 100GBASE-LR4 800GH 100GE 78125GB 100GBASELR4
Abstract: clock mode 148-pin CBGA package Typical power dissipation 2.3 W DEVICE SPECIFICATION APPLICATIONS , . 12 Figure 6. S3091 148-Pin CBGA Package , ) (Die BOTTOM View) 12 S3091 ­ SONET/SDH/ATM OC-192 16:1 Transmitter Figure 6. S3091 148-Pin CBGA -
OCR Scan
HM3500R HVM10000R 244-P HM10000R DDDD32T M2018

diode 148

Abstract: MDS-148 148-PIN PLASTIC FBGA (12x12) OUTLINE DRAWINGS w D S B ZD D1 B 13 12 11 10 9 8 7 6 5 4 3 2 1 ZE A E1 E NM L K J HG F E DC B A w INDEX MARK S A 4-C1.0 4-R0.3 A 25° y1 A2 S S y S e 148- b A1 x M S A B ITEM D MILLIMETERS 12.00±0.10 D1 11.4 E E1 12.00±0.10 11.4 w 0.20 e A 0.80 1.31±0.15 A1 A2 0.35±0.10 0.96 b 0.50+0.05 -0.10 x 0.08 y y1 ZD ZE 0.10 0.20 1.2
M/A-COM
Original
MD-148 MDS-148 diode 148 MD-/MDS-148 MIL-STD-883
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