NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: condition now includes 0V & 3.6V end points (0 = VIN = 3.6V). Added 132-ball chip scale BGA power supply and NC connections. Added 132-ball chip scale BGA logic signal connections for LC4064ZC LC4064ZC, LC4128ZC LC4128ZC and ... | Original |
1 pages, |
diode 4000v LC4064ZC LC4128ZC 4000Z LC4256ZC LC4256V/B/C 160-I/O 4128ZC 4032ZC 4064ZC 4256Z 4000Z/C/V LC4064ZC abstract |
|
|||
| Abstract: 64+10 3.7 3.2 2.5 250 1.8 25 48-pin TQFP 56-ball csBGA 100-pin TQFP 132-ball , 132-ball csBGA ispMACH 4256ZC 4256ZC 256 64+10 96+6 128+4 4.5 3.8 2.9 200 1.8 55 100-pin TQFP 132-ball csBGA 176-pin TQFP ispMACH 4000V/B/C Family Attributes V = 3.3V, B = 2.5V, C = ... | Original |
2 pages, |
ispMACH 4128V Telematic 4032V FTBGA 4000Z 4000Z abstract |
|
|||
| Abstract: BC128 64+10 4 3.3 2.8 250 1.8 25 48-pin TQFP 56-ball csBGA 100-pin TQFP 132-ball csBGA ispMACH 4128ZC 4128ZC 128 64+10 96+4 4.5 3.9 2.9 220 1.8 30 100-pin TQFP 132-ball , TQFP 132-ball csBGA 176-pin TQFP ispMACH 4000V/B/C Family Attributes V = 3.3V, B = 2.5V, C = 1.8V ... | Original |
2 pages, |
ieee 1532 ISP e2cmos technology TQFP 132 PACKAGE ispMACH 4000 4128V 4032V 4000Z 4000Z abstract |
|
|||
| Abstract: R Chip Scale BGA (CP132/CPG132 CP132/CPG132) Package PK373 PK373 (v1.3) June 25, 2008 132-BALL CHIP SCALE BGA 0.50mm PITCH (CP132/CPG132 CP132/CPG132) © 2004-2008 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice. PK373 PK373 (v1.3) June 25, 2008 www.xilinx.com 1 R Chip Scale ... | Original |
2 pages, |
CP132 CPG132 CP132/CPG132 PK373 132-BALL CP132/CPG132 abstract |
|
|||
| Abstract: 56 MachXO27000 112 115 115 105 105 207 207 45 132-ball csBGA 256-ball , , MachXO2-640 in a 132-ball csBGA package has 25 NC pins, while MachXO2-256 in the same package has 49 NC pins. , Migration Density Migration in 132-Ball csBGA Package Table16-4. Density Migration in 132-Ball csBGA , Migration Table16-4. Density Migration in 132-Ball csBGA Package (Continued) 132 csBGA Ball MachXO2 ... | Original |
18 pages, |
package 256-FTBGA CABGA PR18A PT15A PT25B PL21B pb12C PB12A PT28D MachXO2-4000 MACHXO2 PB10A PB10B PR10B MachXO2-7000 TN1200 TN1200 abstract |
|
|||
| Abstract: 100-Pin PQFP 100-Pin TQFP 120-Pin PQFP 128-Pin PQFP 128-Pin TQFP 132-Ball csBGA 132-Ball ucBGA ... | Original |
2 pages, |
1152-ball 416-ball PB1240H PB1240H abstract |
|
|||
| Abstract: PQFP 128-Pin PQFP 128-Pin TQFP 132-Ball csBGA 132-Ball ucBGA 133-Pin CPGA 144-Ball csBGA ... | Original |
3 pages, |
REELS CABGA 56 PB1240I PB1240I abstract |
|
|||
| Abstract: ) 78 74 132-ball csBGA (8 x 8 mm) 101 101 101 256-ball ftBGA (17 x 17 mm) 159 , Number of PLLs 2 2 VCC Voltage (V) 1.2 1.2 132-ball csBGA (8 x 8 mm) 86 86 , package body size. 100-BALL 100-BALL CSBGA 132-BALL CSBGA 100-PIN 100-PIN TQFP 256-BALL 256-BALL FTBGA 256-BALL 256-BALL , M100 = 100-pin csBGA M132 = 132-ball csBGA F256 = 256-ball fpBGA F324 = 324-ball fpBGA FT256 FT256 = , = 100-pin Lead-Free csBGA M132 = 132-ball Lead-Free csBGA F256 = 256-ball Lead-Free fpBGA F324 = ... | Original |
24 pages, |
DDR333 F324 lattice xp2 LCMXO1200 LCMXO2280 LCMXO256 LCMXO640 Oxford Semiconductor mac download PAC607 MachXO2280C MachXO1200C LFXP10 LFXP3C demo cd 7231 datasheet abstract |
|
|||
| Abstract: ) Available in Commercial and Industrial Temperature Ranges Available in 100-lead TQFP and 132-ball CBGA , 1-2 show the pin assignments for the 100-lead TQFP and 132-ball CBGA packages, respectively. 2 , /O I/O I/O I/O VCCIOA I/O N P Notes: 1. The 132-ball CBGA package is 8 x 8 x , Dedicated Pin 132-ball CBGA 100-lead TQFP INPUT / OE2 / GCLK2 C3 90 INPUT / GCLR A3 , Table 13-2. ATF1508RE ATF1508RE I/O Pinouts MC 100-lead TQFP 132-ball CBGA MC Logic Block ... | Original |
31 pages, |
LVCMOS33 LVCMOS25 LVCMOS15 Atmel PART DATE CODE 470PF verilog code voltage regulator PLD-10 datasheet abstract |
|
|||
| Abstract: Temperature Ranges Available in 100-lead TQFP and 132-ball CBGA Advanced Digital CMOS Technology 100% , Figures 1-1 and 1-2 show the pin assignments for the 100-lead TQFP and 132-ball CBGA packages , Note: 4 1. The 132-ball CBGA package is 8 x 8 x 1.2 mm in size with 0.5 mm ball spacing. , Dedicated Pin 132-ball CBGA 100-lead TQFP INPUT / OE2 / GCLK2 C3 90 INPUT / GCLR A3 , Pinouts MC 100-lead TQFP 132-ball CBGA MC Logic Block 100-lead TQFP 132-ball ... | Original |
30 pages, |
LVCMOS33 LVCMOS25 LVCMOS15 ATF1508BE-7AU100 ATF1508BE-5AX100 datasheet abstract |
|
|||
| Abstract: 10 Gbit/s Receiver, CDR and DeMUX GD16584/GD16588 GD16584/GD16588 (FEC) an Intel company Preliminary General Description Features GD16584 GD16584 and GD16588 GD16588 are Receiver chips for use in STM-64/192 STM-64/192 and Optical Transport Networking (OTN) systems. The component is available in two versions: u GD16584 GD16584 for 9.5328 Gbit/s. u GD16588 GD16588 for 10.66 Gbit/s for OTN or Forward Error Correction (FEC). Except the different operating bit rates the two versions are functional identical. The receiver is a Clock ... | Original |
15 pages, |
STM-64 GD16588 DO15 DO13 package GD16585 GD16584 bang bang phase detector GD16584/GD16588 GD16584/GD16588 abstract |
|
|||
| Abstract: 10 Gbit/s Transmitter MUX with Re-timing GD16585/GD16589 GD16585/GD16589 (FEC) an Intel company Preliminary General Description Features GD16585 GD16585 and GD16589 GD16589 are transmitter chips used in SDH STM-64 STM-64 and SONET OC-192 OC-192 optical communication systems. The device is available in two versions: u GD16585 GD16585 for 9.5328 Gbit/s. u GD16589 GD16589 for 10.66 Gbit/s with Forward Error Correction (FEC). Except the different operating bit rate the two versions are functional identical. The transmitter integrates ... | Original |
17 pages, |
STM-64 GD16589 GD16585 GD16585/GD16589 GD16585/GD16589 abstract |
|
|||
| Abstract: Semiconductor 132-ball csBGA BGA Breakout Examples These examples place a MachXO PLD in a 8x8 mm, 0.5 mm pitch, 132-ball csBGA package (LCMXO640M132/MN132 LCMXO640M132/MN132) into two fabrication scenarios. One for a 6-layer , Artwork Screen Shots, Example #1, 132-ball csBGA Layer 1 Primary Layer 2 GND Layer 3 Power Layer , Figure 19-7. CAM Artwork Screen Shots, Example #2, 132-ball csBGA Layer 1 Primary Layer 2 GND ... | Original |
19 pages, |
IPC7351 LC4256ZE 4000ZE bga 196 land pattern pcb design 0,4 mm pitch micro pitch BGA of component with BGA Staggered Pins CABGA 8X8 MN64 package dimension 256-FTBGA TN1074 nomenclature pcb hdi ultra fine pitch BGA TN1074 abstract |
|
|||
| Abstract | Saved from | Date Saved | File Size | Type | Download |
| Over 1.1 million files (1986-2013): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer. |
|||||
| Packages SOT599-1 ; plastic thin fine-pitch ball grid array package; 132 balls; body 12 x 12 x 0.8 mm SOT599-1 TFBGA132 TFBGA132 TFBGA132 TFBGA132 plastic thin fine-pitch ball grid array package; 132 balls; body 12 x 12 x 0.8 mm 00-03-04 Soldering Information Thermal considerations www.datasheetarchive.com/files/philips/packages/sot599-1-v2.html |
Philips | 05/02/2002 | 4.99 Kb | HTML | sot599-1-v2.html |
| Packages Information on package SOT599-1 plastic thin fine-pitch ball grid array package; 132 balls; body 12 x 12 x 0.8 mm Outline drawing Package version Package name Package description Drawing issue date SOT599-1 TFBGA132 TFBGA132 TFBGA132 TFBGA132 plastic thin fine-pitch ball grid array package; 132 balls; body 12 x 12 x 0.8 mm 00-03-04 General package information Soldering Information Thermal www.datasheetarchive.com/files/philips/packages/sot599-1.html |
Philips | 24/04/2003 | 1.83 Kb | HTML | sot599-1.html |
| Packages Information on package SOT599-1 plastic thin fine-pitch ball grid array package; 132 balls; body 12 x 12 x 0.8 mm Outline drawing Package version Package name Package description Drawing issue date SOT599-1 TFBGA132 TFBGA132 TFBGA132 TFBGA132 plastic thin fine-pitch ball grid array package; 132 balls; body 12 x 12 x 0.8 mm 7/9/2003 General package information www.datasheetarchive.com/files/philips/packages/sot599-1-v1.html |
Philips | 17/06/2005 | 1.93 Kb | HTML | sot599-1-v1.html |
| Packages Information on package SOT599-1 plastic thin fine-pitch ball grid array package; 132 balls; body 12 x 12 x 0.8 mm Outline drawing Package version Package name Package description Drawing issue date SOT599-1 TFBGA132 TFBGA132 TFBGA132 TFBGA132 plastic thin fine-pitch ball grid array package; 132 balls; body 12 x 12 x 0.8 mm 7/9/2003 Chemical content www.datasheetarchive.com/files/philips/packages/sot599-1-v3.html |
Philips | 16/06/2005 | 3.94 Kb | HTML | sot599-1-v3.html |
| 12x12 mm 132 balls www.datasheetarchive.com/files/stmicroelectronics/stonline/prodpres/dedicate/wireless/technolo/lfbga.htm |
STMicroelectronics | 20/07/2000 | 6.51 Kb | HTM | lfbga.htm |
| 132 balls 144 balls www.datasheetarchive.com/files/stmicroelectronics/stonline/prodpres/dedicate/wireless/technolo/tfbga.htm |
STMicroelectronics | 20/07/2000 | 11.29 Kb | HTM | tfbga.htm |
| plastic thin fine-pitch ball grid array package; 132 balls; body 12 x 12 x 0.8 mm 2000 www.datasheetarchive.com/files/philips/packages/plastic/surfacemount/array/zzz_other/tfbga-v1.html |
Philips | 05/02/2002 | 14.27 Kb | HTML | tfbga-v1.html |
| plastic thin fine-pitch ball grid array package; 132 balls; body 12 x 12 x 0.8 mm 2000 www.datasheetarchive.com/files/philips/packages/plastic/surfacemount/array/zzz_other/tfbga.html |
Philips | 15/04/2003 | 15.33 Kb | HTML | tfbga.html |
| /22/2004 - SOT599-1 TFBGA132 TFBGA132 TFBGA132 TFBGA132 plastic thin fine-pitch ball grid array package; 132 balls; body 12 x 12 x www.datasheetarchive.com/files/philips/packages/plastic/surfacemount/array/zzz_other/tfbga-v2.html |
Philips | 16/06/2005 | 18.03 Kb | HTML | tfbga-v2.html |
| n 132 balls 12x12x1.7 mm LBGA package n Power Consumption: 0.75 Watt n Power Supp.: 2.5 V www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/7440.htm |
STMicroelectronics | 30/11/2000 | 66.66 Kb | HTM | 7440.htm |