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LM5080MM/NOPB Texas Instruments Modular Current Sharing Controller 8-VSSOP
LM5080MMX/NOPB Texas Instruments SPECIALTY ANALOG CIRCUIT, PDSO8, ROHS COMPLIANT, MSOP-8

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Part : LM5080MM/NOPB Supplier : Texas Instruments Manufacturer : Avnet Stock : - Best Price : €0.6829 Price Each : €1.0244
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Part : LM5080MM/NOPB Supplier : Texas Instruments Manufacturer : Rochester Electronics Stock : 1,100 Best Price : $0.74 Price Each : $0.91
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Part : FL2500-NO.3-J1-0-80MM Supplier : TE Connectivity Manufacturer : Sager Stock : - Best Price : $0.3429 Price Each : $0.4318
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080mm

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: -03264 IC274-038192 IC274-040149 IC274-04248 IC274-048127 31 32 32 38 40 42 48 0.80mm 0.75mm 0.80mm 0.75mm 0.75mm 1.00mm 0.65mm G rid â'" 6X6 4X8 5 X 10 6X11 6X7 6X8 Body Siza , 1521 2009 Pitch 0.65mm 0.80mm 0.80mm 0.80mm 0.80mm 0.75mm 0.80mm 0.75mm 1.00mm 0.80mm 1.00mm 0.80mm 0.80mm 0.80mm 0.80mm 1.00mm 1.27mm 0.80mm 1.00mm 0.80mm 0.80mm 0.80mm 0.50mm 1.00mm 0.80mm 1.27mm 0.80mm 0.80mm 0.80mm 1.00mm 0.50mm 0.50mm 0.80mm 0.80mm 0.80mm 1.50mm -
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IC274 IC274-1S1 000MQ IC274-048126 IC274-048170 IC274-052203
Abstract: -038192 IC274-040149 IC274-04248 IC274-048127 N o . o f L ea ads 31 32 32 38 40 42 48 Pitch 0.80mm 0.75mm 0.80mm 0.75mm 0.75mm 1.00mm 0.65mm G rid d Ñ 6X6 4X8 5 X 10 6 X 11 6X7 6X8 B o d y Siz ze 8.1mm X , 1296 1441 1521 2009 Pitch 0.65mm 0.80mm 0.80mm 0.80mm 0.80mm 0.75mm 0.80mm 0.75mm 1.00mm 0.80mm 1.00mm 0.80mm 0.80mm 0.80mm 0.80mm 1.00mm 1.27mm 0.80mm 1.00mm 0.80mm 0.80mm 0.80mm 0.50mm 1.00mm 0.80mm 1.27mm 0.80mm 0.80mm 0.80mm 1.00mm 0.50mm 0.50mm 0.80mm 0.80mm 0.80mm 1.50mm 1.00mm 0.50mm 0.80mm 1.27mm 0.75mm Yamaichi Electronics
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ic27424 X2316 IC274-
Abstract: '104-Plusâ"¢ Socket (ESQT Series). 203 0.80mm Flex Stack. Surface Mount Micro Board Stacker. 162 , Plugs.42 0.80mm Base Blade & Beam Socket , .233 0.80mm Base Blade & Beam Header.159 0.50mm Base Blade & Beam Header , PCB Mount Jack. 278 0.80mm Cost-effective Mocro Socket , .208 DEC8 DIN7A DPAF DPAM DW DWM 0.80mm Edge Rate" Doubte Edge Card Socket. 120 -
OCR Scan
F-212 ACP-12 ACP-16 ACP-22 ACR-12 ACR-16
Abstract: (1608) [EIA CC0603] Size Length(L) 1.60mm +0.20/-0.10mm Width(W) 0.80mm +0.15/-0.10mm Thickness(T) 0.80mm +0.15/-0.10mm Terminal Width(B) 0.20mm Min. Terminal Spacing(G) 0.30mm Min. Recommended Land Pattern(PA) 0.70 to 1.00mm (Flow Soldering)0.60 to 0.80mm (Reflow Soldering) Recommended Land Pattern(PB) 0.80 to 1.00mm (Flow Soldering)0.60 to 0.80mm (Reflow Soldering) Recommended Land Pattern(PC) 0.60 to 0.80mm (Flow Soldering)0.60 to 0.80mm (Reflow TDK
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CGA3E2X7R1H103K080AE CGA3E2X7R1H103KT AEC-Q200 10000M 4000P
Abstract: range of MDC connectors which covers the mated height of 3mm to 5.5 mm. 0.80mm (.031") Pitch , Notebook Industry 0.80mm (.031") Pitch Board-to-Board MDC Connector 48126 SMT Plug 48168, 48210, 48211 , Carrier Tape Width 16.00mm MDC 0.80mm (.031") pitch, Borad-to-board Plug, SMT, 3.50mm (.138") mated heigh MDC 0.80mm (.031") pitch, Borad-to-board Receptacle, SMT, 3.00mm (.118") mated height MDC 0.80mm (.031") pitch, Borad-to-board Receptacle, SMT, 3.50mm (.138") mated height MDC 0.80mm (.031") pitch Molex
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azalia 48-211 48126 molex 1-800-78MOLEX SNG-043
Abstract: 1 3.20mm 2.40mm YYWW PI2xxx 7.00mm ±0.03mm 2 17 3 0.80mm 0.00mm 0.80mm , Pads (Pins 6 - 14) Copper Defined 1.60mm 0.80mm 0.40mm ±0.05mm 0.30mm ±0.05mm 0.89mm B B: Power Pads (Pins 1 - 5, 15 - 17) Soldermask Defined 0.80mm 0.80mm 1.20mm 0.80mm 0.53mm 0.73mm 1.09mm Pin 1 0.80mm 1.20mm 0.80mm 1.20mm Notes: SM = Solder mask , . 0.80mm 0.80mm SM 0.63mm PAD 0.55mm SM 0.60mm SM 1.25mm SM 0.55mm PAD 0.50mm Figure 8 ­­ Picor
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picor LGA rework JEDEC Drawing LGA MLCC rework reflow profile FOR LGA COMPONENTS LGA Application Notes PI2122
Abstract: mechanical integrity. (Wire-to-Board) and (Board-to-Board) 0.80mm (.031") Receptacle and Plug Vertical (plugs , 45339-1600 45593-1600 45560-0160 45560-0161 Description 0.80mm (.031") Pitch HandyLinkTM Right Angle SMT USA Receptacle 0.80mm (.031") Pitch HandyLinkTM Plug for Wire USA Termination, 16 Circuit 0.80mm (.031") Pitch HandyLinkTM Plug for PCB USA Termination, 16 Circuit 0.80mm (.031") Pitch HandyLinkTM Cradle Connector Mexico Perpendicular SMT Plug 0.80mm (.031") Pitch HandyLinkTM Cradle Connector Parallel USA SMT Plug Quantity in Kit 3 Molex
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MOLEX COUNTRY OF origin CODE 44828-1162 IP-54
Abstract: -136-AC 7mm 7mm CU 0.80mm 394 394 VBE32A MO-136-BC 7mm 7mm CU 0.80mm 394 394 VEF44A 10mm CU 0.80mm 530 530 MO-136-BG 10mm 10mm CU 0.80mm 512 512 VEK44A MS-022-AB 10mm 10mm CU 0.80mm 559 559 VGZ44A MO-108-AC 10mm 10mm CU 0.80mm 559 559 VJC44A MO-136-AQ 14mm 14mm CU 1.0mm 669 669 , 716 VJZ60A None 14mm 14mm CU 0.80mm 732 732 VEH64A MO-136-BJ 10mm National Semiconductor
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MA05A MO-178-AA ad 153 transistor MO-16B-AB vjp44a transistor bd 905 mkt 344 MS-026-bcd MS011798 MA04A MA05C MA05B
Abstract: (1608) [EIA CC0603] Size Length(L) 1.60mm +0.20/-0.10mm Width(W) 0.80mm +0.15/-0.10mm Thickness(T) 0.80mm +0.15/-0.10mm Terminal Width(B) 0.20mm Min. Terminal Spacing(G) 0.30mm Min. Recommended Land Pattern(PA) 0.70 to 1.00mm (Flow Soldering)0.60 to 0.80mm (Reflow Soldering) Recommended Land Pattern(PB) 0.80 to 1.00mm (Flow Soldering)0.60 to 0.80mm (Reflow Soldering) Recommended Land Pattern(PC) 0.60 to 0.80mm (Flow Soldering)0.60 to 0.80mm (Reflow TDK
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CGA3E2X7R1H104K080AE CGA3E2X7R1H104KT 5000M
Abstract: Pitch 1.27mm 1.27mm 1.00mm 1.27mm 1.524mm 1.00mm 0.80mm 0.80mm 1.27mm 1.27mm 1.00mm 0.80mm , 1.0mm 1.5mm 1.27mm 1.00mm 1.00mm 0.80mm 1.50mm 1.50mm 1.27mm 1.00mm 1.27mm Array Size 10 , x 13 SF-BGA176C-B-11 176 1.00mm 14 x 14 SF-BGA179A-B-01 179 0.80mm 14 x 14 SF-BGA180A-B-01 180 0.80mm 14 x 14 SF-BGA180C-B-01 180 0.8mm 16 x 16 SF-BGA192A-B-01 192 1.27mm 17 x 17 , 16 SF-BGA196G-B-11 196 1.00mm 17x17 SF-BGA200A-B-01 200 0.80mm 15x15 SF-BGA204A-B-01 204 Ironwood Electronics
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PA-SO42-S-01 PA-PGA181-02W PA-PGA68-01 BGA169C actel 14100 PA-PLCC84-02 PA-ZIP36-01W 12X12 FR4/G10
Abstract: Use With 76105 iPass+â"¢ HSC CXP, 0.80mm Pitch, External Application, Integrated Cage and Connector Assembly, Right Angle, Press-Fit, 84 Circuit Application Tooling | FAQ Description Product # 0.80mm , Assembly, Right Angle, Press-Fit, 84 Circuit, 0.76Âum Gold (Au) Plating, No Cover 0.80mm Pitch , , Press-Fit, Left Key Ethernet,84 Circuit, 0.76Âum Gold (Au) Plating, LeadFree 0.80mm Pitch, 0761050585 , , Left Key Infiniband, 84 Circuit, 0.76Âum Gold (Au) Plating, LeadFree 0.80mm Pitch, 1704650002 Ironwood Electronics
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SF-PLCC84-J-01 PL-PLCC68-S-01 PL-PLCC68-T-01 SF-PLCC28-J-01 sf 128 transistor SO8A SF-SO56F-L-01 SF-SO56F-L-03 SF-SO86A-L-01 SF-SOJ20A-J-01 SF-SOJ20A-J-02 SF-SOJ20B-J-01
Abstract: -047-AF 1150 1150 CU 50 1195 1195 VBA32A MO-136-AC 7mm 7mm CU 0.80mm 394 , 0.80mm 394 394 530 VEF44A 10mm CU 0.80mm 530 MO-136-BG 10mm 10mm CU 0.80mm 512 512 VEK44A MS-022-AB 10mm 10mm CU 0.80mm 559 559 VGZ44A MO-108-AC 10mm 10mm CU 0.80mm 559 559 VJC44A MO-136-AQ 14mm 14mm CU 1.0mm 669 , 1.0mm 716 716 VJZ60A None 14mm 14mm CU 0.80mm 732 732 VEH64A MO Molex
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T1324 ATS-622030030 T1324S
Abstract: /(1.27mm) H = .039/(1.00mm) J = .0315/(0.80mm) See options - available with Standard, male to male , -700 1.27mm pitch 1.00mm pitch 0.80mm pitch .159 (4.04) .182 (4.62) .062 (1.57 , Type -735 Type -732 1.27mm pitch 1.00mm pitch 0.80mm pitch .062 (1.57) .218 (5.54 , -720 Lead-free: Type -823 .062 (1.57) 1.00mm pitch 0.80mm pitch .020/(0.51) Dia. Solder , Body Type RoHS Compliant Insulators: Terminal Plating F - FR-4 (0.80mm pitch) RoHS Compliant: M National Semiconductor
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T03A TO-202 transistor MTL 728 Cu50 TRANSISTOR BC 136 TRANSISTOR BC 530
Abstract: Outline and Pad Layout TS8405P Ø 0.30mm Solder Mask Ø ~ 0.40mm D D 0.80mm G SILICON S 0.27mm 0.80mm 0.80mm MAX D = Drain Pad S = Source Pad G = Gate Pad LAND PATTERN RECOMMENDATION 1.50mm 0.35mm 1.50mm 0.80mm EXXXX BACKSIDE VIEW (NO BUMP SIDE VIEW) Bump Ø 0.37mm 0.80mm 0.35mm Mark on backside of die Bumps are Eutectic solder 63/37 Sn/Pb E = 8405P Advanced Interconnections
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BGA 731 0.65mm pitch BGA bga thermal cycling reliability ASTM-B-488 C17200
Abstract: -4 Pitch G = .050/(1.27mm) H = .039/(1.00mm) J = .0315/(0.80mm) Number of Positions Model Type A = , BGA Sockets on pages 8-9 Standard Terminals 1.27mm pitch BGA Adapters 0.80mm pitch Additional , Type -735 0.80mm pitch Type -732 Male to Male .062 (1.57) .342 (8.69) .218 (5.54) .230 , Ball Tin/Lead: Type -736 Lead-free: Type -829 0.80mm pitch .020/(0.51) Dia. Solder Ball .030 , F - FR-4 (0.80mm pitch) RoHS Compliant: M - Molded LCP (1.00mm pitch)* G - Gold R - Molded LCP Ironwood Electronics
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FP-X4KPG223-01 SF-QFE352SA-L-01 BGA165 CA-SO18A-Z-J-T-01 bga96 BGA292 FP-X2KPC68-01 FP-X2KPC84-01 FP-X3KPC84-01 FP-X3KPC84-02 FP-X3KPG132-01 FP-X3KPG175-01
Abstract: This document was generated on 01/13/2011 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0540300471 Planned for Obsolescence 0.80mm (.031") Pitch IEEE P1394a Shielded I/O PCB Socket Right Angle, PC Tail Length 2.00mm, Lead-free Documents: 3D Model , , Steel Gold, Tin Tin High Temperature Thermoplastic 1 Right Angle 2.00mm (.079") Yes Yes 0.80mm (.031") Tube No 0.80mm (.031") 0.80mm (.031") 0.762um (30u") 0.762um (30u"), 1.016um (40u") Yes Yes 1 No -25°C Taiwan Semiconductor
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Abstract: -5040-220* Contacts Row Spacing Pitch 50 0.4 (Mils.) 0.80mm A 28.07 (1.105) B 19.20 (0.756) C D 21.60 15.72 , ) Contacts Row Spacing Pitch A B C D 50 0.400 (Mils.) 0.80mm 11.05 ~ 11.30 10.00 ~ 10.30 20.80 ~ 21.10 3.25 , Dimensions SOJ 0.8mm Pitch SMT IC170 Series Sockets PCB Layout A B 0.80mm Pitch Pin 1 ID E F 0.80 D 1.50 Contact Detail C 0.45 0.65 IC Outline Dimensions C 0.80mm Pitch Advanced Interconnections
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Abstract: -5040-220* Contacts Row Spacing Pitch 50 0.4 (Mils.) 0.80mm A 28.07 (1.105) B 19.20 (0.756) C D 21.60 15.72 , ) Contacts Row Spacing Pitch A B C D 50 0.400 (Mils.) 0.80mm 11.05 ~ 11.30 10.00 ~ 10.30 20.80 ~ 21.10 3.25 , Dimensions SOJ 0.8mm Pitch SMT IC170 Series Sockets PCB Layout A B 0.80mm Pitch Pin 1 ID E F 0.80 D 1.50 Contact Detail C 0.45 0.65 IC Outline Dimensions C 0.80mm Pitch Molex
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P1394 PS-54030-032 PS-54030-033 PS-54030-034 PS-54030-035 PS-54030-036
Abstract: ) 0.60mm / 1.00mm b) ceramic chips (BCW) 0.60mm / 1.00mm 0.50mm / 0.70mm 0.80mm / 1.00mm 0.50mm 0.65mm 0.75mm & 0.80mm 1.00mm Ø 0,70mm/.028" if pitch 1,27mm Ø 0,60mm/.023" if pitch 1,00mm Ø 0,50mm , rating 500 mA max. Insulation resistance at 500V DC 100 M if 0.50 to 0.80mm pitch 500 M 1.00mm pitch , ,80mm pitch, 2.30mm if 0.50mm pitch ) special raised SMT - only for 1.00 & 0.80mm pitch. ( ,A , 0.80mm pitch, 2,30mm if 0.50mm pitch ) special short solder tail - only for 1,27mm pitch Yamaichi Electronics
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IC170- IC170-5040-220
Abstract: QRF8-RA 0,80mm Q Rate4Slim Body Right Angle Socket_ 75 QRM8 0.80mm Q Rate" Slim Body Ground Rane , . 68 QSS-RA 0.635mm Q Strip'1Right Angle Ground Plane Socket. .69 QTE 0.80mm Q Strip4 , . 185 Application Specific RF 0.80mm Rseljp , ,27mm SEARAYâ'™â' High Density Open Pin Field. Socket. 100 SEAF8 0.80mm SEARAY â' Ultra High , . 147 SEM 0.80mm Mcro Tiger Eye â' SEML 0.80mm Yamaichi Electronics
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Abstract: 0.75mm 0.25mm / 0.45mm 0.15mm / 0.40mm 0.80mm 0.40mm / 0.55mm 0.25mm / 0.45mm 1.00mm 0.50mm , ) ceramic chips (BCW) 0.60mm / 1.00mm 0.80mm / 1.00mm For top view socket dimension pls. ref. to , < 100 m Current rating 500 mA max. Insulation resistance at 500V DC 100 M if 0.50 to 0.80mm pitch , ; 0,40mm if Actel
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0.35mm pitch BGA BGA 0.35mm pitch BGA Solder Ball 0.35mm bga socket 0.35mm BGA
Abstract: (1608) [EIA CC0603] Size Length(L) 1.60mm +0.20/-0.10mm Width(W) 0.80mm +0.15/-0.10mm Thickness(T) 0.80mm +0.15/-0.10mm Terminal Width(B) 0.20mm Min. Terminal Spacing(G) 0.30mm Min. Recommended Land Pattern(PA) 0.70 to 1.00mm (Flow Soldering)0.60 to 0.80mm (Reflow Soldering) Recommended Land Pattern(PB) 0.80 to 1.00mm (Flow Soldering)0.60 to 0.80mm (Reflow Soldering) Recommended Land Pattern(PC) 0.60 to 0.80mm (Flow Soldering)0.60 to 0.80mm (Reflow -
OCR Scan
1-800-SAM
Abstract: 7mm CU 0.80mm 394 394 VBE32A MO-136-BC 7mm 394 7mm CU 0.80mm 394 VEF44A 10mm 10mm CU 0.80mm 530 530 VEJ44A MO-136-BG 10mm 10mm CU 0.80mm 512 512 VEK44A MS-022-AB 10mm 10mm CU 0.80mm 559 559 VGZ44A MO-108-AC 10mm 10mm CU 0.80mm 559 559 VJC44A MO-136-AQ 14mm 14mm CU 1.0mm 669 669 VJP44A MS , -022-BD 14mm 14mm CU 1.0mm 716 716 VJZ60A None 14mm 14mm CU 0.80mm 732 732 Würth Elektronik
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UL94-V0
Abstract: 0.80-mm UBGA (BT Substrate) NSMD Land Pads 0.8 mm (31.50 mil) 0.46 mm (18.11 mil) 0.46 mm , pads. Figure 9 shows both layouts for 0.80-mm UBGA(BT Substrate) NSMD land pads. Figure 9. Placement of Via Capture Pad for 0.80-mm UBGA (BT Substrate) NSMD Land Pads In Line Diagonally 0.80 mm , assistance. Table 5. Formula for Via Layouts for 0.80-mm UBGA (BT Substrate) NSMD Land Pads Layout , Packages Figure 11. Typical and Premium Via Capture Pad Sizes for a 0.80-mm UBGA (BT Substrate -
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K2547 J 6920 A CS81 DS06 IEEE1394
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